Blue Diode Laser Welding of Commercially Pure Titanium Foils

IF 1.3 Q3 INSTRUMENTS & INSTRUMENTATION Quantum Beam Science Pub Date : 2022-07-18 DOI:10.3390/qubs6030024
T. Pasang, P. Lin, W. Misiolek, Jianjin Wei, S. Masuno, M. Tsukamoto, Eiji Hori, Yuji Sato, Y. Tao, Danang Yudhistiro, S. Yunus
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引用次数: 1

Abstract

The need for thin foil welding is increasing significantly, particularly in the electronic industries. The technologies that are currently available limit the joining processes in terms of materials and their geometries. In this paper, a series of trials of fusion welding (bead-on- plate) of commercially pure titanium (CPTi) foils were conducted using a blue diode laser (BDL) welding method. The power used was 50 W and 100 W for 0.1 mm and 0.2 mm thick foils, respectively. Following welding, various samples were prepared to examine the weld profiles, microstructures, hardness, tensile strength, and fracture surface characteristics. The results showed that the base metal (BM) had an annealed microstructure with equiaxed grains, while the weld zones contained martensite (α’) with large grains. The hardness increased in both regions, from around 123 HV to around 250 HV, in the heat-affected zone (HAZ) and fusion zone (FZ) areas. The tensile tests revealed that the strengths of the welded samples were slightly lower than the unwelded samples, i.e., UTS = 300–350 MPa compared with 325–390 MPa for the unwelded samples. Fracture took place within the BM area. All of the samples, welded and unwelded, showed identical fracture mechanisms, i.e., microvoid coalescence or ductile fracture. The weld zone experienced very small strains (elongation) at fracture, which indicates a good weld quality.
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商用纯钛箔的蓝光二极管激光焊接
对薄箔焊接的需求正在显著增加,特别是在电子工业中。目前可用的技术在材料及其几何形状方面限制了连接过程。本文采用蓝色二极管激光(BDL)焊接方法对商用纯钛(CPTi)箔进行了一系列熔焊(板上焊珠)试验。对于0.1mm和0.2mm厚的箔,所使用的功率分别为50W和100W。焊接后,制备各种样品,以检查焊缝轮廓、微观结构、硬度、拉伸强度和断裂表面特征。结果表明,母材(BM)具有等轴晶粒的退火组织,而焊接区含有大晶粒的马氏体(α’)。在热影响区(HAZ)和熔合区(FZ),两个区域的硬度都有所增加,从约123HV增加到约250HV。拉伸试验表明,焊接样品的强度略低于未焊接样品,即UTS=300–350 MPa,而未焊接样品的UTS=325–390 MPa。断裂发生在BM区域内。所有焊接和未焊接的样品都显示出相同的断裂机制,即微孔聚结或韧性断裂。焊接区在断裂时经历非常小的应变(伸长率),这表明焊接质量良好。
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来源期刊
CiteScore
2.80
自引率
28.60%
发文量
27
审稿时长
11 weeks
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