{"title":"Research on the influence of stamping materials on resist flow and the residual layer in thermal nanoimprint lithography","authors":"Hong-Wen Sun, Tian-Hua Tang, Jing-Sheng Wang, Li-Jun Gu, Yan-Chun Huang, Ya-Ru Li","doi":"10.1049/mna2.12175","DOIUrl":null,"url":null,"abstract":"<p>Various stamp materials can significantly affect the filling quality of nanoimprint lithography (NIL). The effects of different stamp materials on the imprinting process were investigated from the angles of residual layer (RL) thickness, contact pressure, and filling proportion. The selection of various stamp materials affects the thickness and uniformity of the RL. Soft stamps (PDMS, PU) leave a thin but uneven RL distribution, while the RL imprinted by hard stamps (Si, Ni) is thicker but more uniform. The contact pressure using soft stamps is relatively more evenly distributed than hard stamps. The uneven distribution of contact pressure leads to poor cavity-filling proportion, especially for hard stamps. This study offers guidance for choosing proper nanoimprint stamp materials for different NIL applications.</p>","PeriodicalId":18398,"journal":{"name":"Micro & Nano Letters","volume":"18 9-12","pages":""},"PeriodicalIF":1.5000,"publicationDate":"2023-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1049/mna2.12175","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Micro & Nano Letters","FirstCategoryId":"88","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1049/mna2.12175","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Various stamp materials can significantly affect the filling quality of nanoimprint lithography (NIL). The effects of different stamp materials on the imprinting process were investigated from the angles of residual layer (RL) thickness, contact pressure, and filling proportion. The selection of various stamp materials affects the thickness and uniformity of the RL. Soft stamps (PDMS, PU) leave a thin but uneven RL distribution, while the RL imprinted by hard stamps (Si, Ni) is thicker but more uniform. The contact pressure using soft stamps is relatively more evenly distributed than hard stamps. The uneven distribution of contact pressure leads to poor cavity-filling proportion, especially for hard stamps. This study offers guidance for choosing proper nanoimprint stamp materials for different NIL applications.
期刊介绍:
Micro & Nano Letters offers express online publication of short research papers containing the latest advances in miniature and ultraminiature structures and systems. With an average of six weeks to decision, and publication online in advance of each issue, Micro & Nano Letters offers a rapid route for the international dissemination of high quality research findings from both the micro and nano communities.
Scope
Micro & Nano Letters offers express online publication of short research papers containing the latest advances in micro and nano-scale science, engineering and technology, with at least one dimension ranging from micrometers to nanometers. Micro & Nano Letters offers readers high-quality original research from both the micro and nano communities, and the materials and devices communities.
Bridging this gap between materials science and micro and nano-scale devices, Micro & Nano Letters addresses issues in the disciplines of engineering, physical, chemical, and biological science. It places particular emphasis on cross-disciplinary activities and applications.
Typical topics include:
Micro and nanostructures for the device communities
MEMS and NEMS
Modelling, simulation and realisation of micro and nanoscale structures, devices and systems, with comparisons to experimental data
Synthesis and processing
Micro and nano-photonics
Molecular machines, circuits and self-assembly
Organic and inorganic micro and nanostructures
Micro and nano-fluidics