{"title":"Boundary contour method fracture analysis of bimaterial interface cracks","authors":"A. Phan, S. Mukherjee","doi":"10.1002/CNM.1060","DOIUrl":null,"url":null,"abstract":"A variant of the boundary element method, called the boundary contour method (BCM), offers a further reduction in dimensionality. Consequently, boundary contour analysis of two-dimensional (2-D) problems does not require any numerical integration at all. The method is thus very computationally effective and accurate as shown in previous related studies. This paper presents a further development of the BCM for multi-region problems in 2-D elasticity, and an application of this development, coupled with the displacement correlation technique, to evaluating the stress intensity factors K1 and K2 for bimaterial interface cracks. Some preliminary tests conducted within this work suggest that the proposed technique is robust and able to provide highly accurate results of both K1 and K2 for this challenging class of fracture problems. Copyright © 2007 John Wiley & Sons, Ltd.","PeriodicalId":51245,"journal":{"name":"Communications in Numerical Methods in Engineering","volume":"24 1","pages":"1685-1697"},"PeriodicalIF":0.0000,"publicationDate":"2007-10-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1002/CNM.1060","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Communications in Numerical Methods in Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1002/CNM.1060","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
双材料界面裂纹的边界轮廓法断裂分析
边界元法的一种变体,称为边界轮廓法(BCM),进一步降低了维数。因此,二维(2-D)问题的边界轮廓分析不需要任何数值积分。因此,在以往的相关研究中表明,该方法具有很高的计算效率和准确性。本文介绍了二维弹性多区域问题的BCM的进一步发展,并结合位移相关技术,应用于双材料界面裂纹的应力强度因子K1和K2的评估。在这项工作中进行的一些初步测试表明,所提出的技术是可靠的,能够为这类具有挑战性的压裂问题提供高度精确的K1和K2结果。版权所有©2007 John Wiley & Sons, Ltd
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