{"title":"Grain growth and thermal stability accompanying recrystallization in undercooled Ni-3at.%Sn alloy","authors":"Z. Chen, Q. Chen, C. J. Shen, F. Liu","doi":"10.1016/J.JALLCOM.2015.06.083","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":344,"journal":{"name":"Journal of Alloys and Compounds","volume":"646 1","pages":"983-989"},"PeriodicalIF":5.8000,"publicationDate":"2015-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/J.JALLCOM.2015.06.083","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Alloys and Compounds","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1016/J.JALLCOM.2015.06.083","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
期刊介绍：
The Journal of Alloys and Compounds is intended to serve as an international medium for the publication of work on solid materials comprising compounds as well as alloys. Its great strength lies in the diversity of discipline which it encompasses, drawing together results from materials science, solid-state chemistry and physics.
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