Effect of adsorbed layers on the anodic oxidation of simple organic compounds. Part 3.—Cu adsorption on Pt and its effect on the oxidation of HCOOH

A. H. Taylor, S. Kirkland, S. Brummer
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引用次数: 14

Abstract

The adsorption and desorption of Cu on a smooth Pt electrode from 1 M H2SO4 solutions which contain a range of Cu2+ concentrations has been studied as a function of potential. The effect of adsorbed Cu on the oxidation rate of HCOOH has been examined at + 0.60 V (RHE). Cu2+ adsorption is controlled largely by an activation process. The slow step in the process is apparently the discharge of Cu2+ at the electrode to Cu+. Desorption of a preadsorbed Cu layer (+0.40 V) is extremely rapid at potentials+ 0.70 V, where no Cu2+ adsorption is normally found. Analysis of the oxidation state of the adsorbing layer by charge and coverage measurements yields a value of 1.92 electrons/site. This indicates that the major part of the layer is Cuads attached to a single Pt surface site. The rate of adsorption of Cu2+ is decreased slightly in the presence of 0.1 M HCOOH. At low coverages (θCuads⩽0.19), a slight enhancement of the HCOOH oxidation rate is observed at +0.60 V. Above this coverage, the oxidation process is inhibited. Results are interpreted in terms of Cu2+ adsorption mechanisms on Pt and the effect of the adsorbed layer on the mechanisms of HCOOH electro-oxidation on Pt.
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吸附层对简单有机化合物阳极氧化的影响。第3部分。-Cu在Pt上的吸附及其对HCOOH氧化的影响
本文研究了不同Cu2+浓度的H2SO4溶液对Cu在光滑Pt电极上的吸附和解吸过程。在+ 0.60 V (RHE)下,考察了吸附Cu对HCOOH氧化速率的影响。Cu2+吸附主要受活化过程控制。该过程的缓慢步骤显然是电极处的Cu2+向Cu+放电。在+ 0.70 V电势下,预吸附Cu层(+0.40 V)的脱附速度非常快,通常没有Cu2+吸附。通过电荷和覆盖率测量对吸附层的氧化状态进行分析,得出1.92个电子/位点的值。这表明该层的主要部分是附着在单个Pt表面的cuad。在0.1 M HCOOH的存在下,对Cu2+的吸附速率略有下降。在低覆盖率(θCuads≥0.19)下,在+0.60 V下观察到HCOOH氧化速率略有增强。在此覆盖范围以上,氧化过程被抑制。结果解释了Cu2+在Pt上的吸附机理,以及吸附层对HCOOH电氧化Pt机理的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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