High-performance embedded SOI DRAM architecture for the low-power supply

IF 4.6 1区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Journal of Solid-state Circuits Pub Date : 2000-08-01 DOI:10.1109/4.859506
T. Yamauchi;F. Morisita;S. Maeda;K. Arimoto;K. Fujishima;H. Ozaki;T. Yoshihara
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Abstract

This paper presents the high-performance DRAM array and logic architecture for a sub-1.2-V embedded silicon-on-insulator (SOI) DRAM. The degradation of the transistor performance caused by boosted wordline voltage level is distinctly apparent in the low voltage range. In our proposed stressless SOI DRAM array, the applied electric field to the gate oxide of the memory-cell transistor can he relaxed. The crucial problem that the gate oxide of the embedded-DRAM process must be thicker than that of the logic process can be solved. As a result, the performance degradation of the logic transistor can be avoided without forming the gate oxides of the memory-cell array and the logic circuits individually. In addition, the data retention characteristics can be improved. Secondly, we propose the body-bias-controlled SOI-circuit architecture which enhances the performance of the logic circuit at sub-1.2-V power supply voltage, Experimental results verify that the proposed circuit architecture has the potential to reduce the gate-delay time up to 30% compared to the conventional one. This proposed architecture could provide high performance in the low-voltage embedded SOI DRAM.
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用于低功耗电源的高性能嵌入式SOI DRAM架构
本文介绍了用于亚1.2伏绝缘体上硅(SOI)嵌入式DRAM的高性能DRAM阵列和逻辑结构。由升压的字线电压电平引起的晶体管性能的退化在低电压范围内是明显的。在我们提出的无应力SOI DRAM阵列中,施加到存储单元晶体管的栅极氧化物的电场可以被弛豫。可以解决嵌入式DRAM工艺的栅极氧化物必须比逻辑工艺的栅极氧化层厚的关键问题。结果,在不单独形成存储单元阵列和逻辑电路的栅极氧化物的情况下,可以避免逻辑晶体管的性能退化。此外,可以改善数据保持特性。其次,我们提出了体偏置控制的SOI电路结构,该结构提高了逻辑电路在低于1.2V电源电压下的性能。实验结果表明,与传统电路结构相比,所提出的电路结构具有将栅极延迟时间减少30%的潜力。这种提出的体系结构可以在低电压嵌入式SOI DRAM中提供高性能。
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来源期刊
IEEE Journal of Solid-state Circuits
IEEE Journal of Solid-state Circuits 工程技术-工程:电子与电气
CiteScore
11.00
自引率
20.40%
发文量
351
审稿时长
3-6 weeks
期刊介绍: The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as circuits modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete circuit design is seldom published. Experimental verification is strongly encouraged.
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