MMLPA: Multilayered Metamaterial Low Profile Antenna for IoT Applications

IF 0.4 Q4 ENGINEERING, MULTIDISCIPLINARY Journal of Advanced Simulation in Science and Engineering Pub Date : 2019-01-01 DOI:10.15748/JASSE.6.273
Tojoarisoa Rakotoaritina, Megumi Saito, Zhenni Pan, Jiang Liu, S. Shimamoto
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Abstract

Nowadays, within the concept of Internet of Things (IoT), smart homes, smart factory, intelligent transportation, smart agriculture networks among others, are infrastructure systems that connect our world to the Internet. However, wireless communications technology, such as wireless cellular networks, wireless area networks, wireless sensor networks, and vehicular communications among others, are considerably constrained by complicated structures, and lossy media in complex environments. Fundamental limitations on the transmission range have been treated to connect IoT devices in complex environments. In order to extend the transmission range in complex environments, Magnetic Induction (MI) communication has been proved to be an efficient solution. In this thesis, Multilayered Metamaterial Low Profile Antennas (MMLPA) using Magnetic Induction communication scheme are designed and prototyped for IoT applications. The channel model of the MMLPA system is analyzed. Then four models of MMLPA system are designed by using circular loop antennas backed with isotropic metamaterial which is considered as Defected Ground Structure (DGS) as well as with anisotropic metamaterial for the purpose of dielectric uniaxial metamaterial. To the best of our knowledge, this is the first work that investigates the performance of a magnetic loop antenna coil backed with multiple layers of isotropic and anisotropic metamaterials for IoT applications in environment that are hostile, RF challenged, and especially in the vicinity of metal. By using a full-wave finite-element method, the proposed analysis is supported with simulation results where good agreement is achieved compared to the measurement results after realizing four prototypes of the MMLPA antennas. The effect of the presence of metal in the vicinity of the transceivers is also analyzed. A MMLPA-IoT system is developed for IoT applications.
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MMLPA:物联网应用的多层超材料低轮廓天线
如今,在物联网(IoT)的概念中,智能家居、智能工厂、智能交通、智能农业网络等都是将我们的世界连接到互联网的基础设施系统。然而,无线通信技术,如无线蜂窝网络、无线局域网、无线传感器网络和车载通信等,在很大程度上受到复杂结构和复杂环境中的有损媒体的限制。为了在复杂环境中连接物联网设备,已经处理了传输范围的基本限制。为了扩大复杂环境下的传输范围,磁感应通信(MI)已被证明是一种有效的解决方案。在本文中,采用磁感应通信方案的多层超材料低轮廓天线(MMLPA)被设计和原型用于物联网应用。分析了MMLPA系统的信道模型。在此基础上,采用各向异性超材料作为介质单轴超材料,采用各向异性超材料作为介质单轴超材料,采用各向异性超材料作为介质单轴超材料,设计了四种MMLPA系统模型。据我们所知,这是第一项研究以多层各向同性和各向异性超材料为背景的磁环天线线圈的性能的工作,该线圈适用于恶劣、射频挑战的环境中,特别是在金属附近的物联网应用。通过采用全波有限元方法,仿真结果支持了所提出的分析,在实现了四个MMLPA天线样机后,仿真结果与测量结果非常吻合。分析了收发器附近金属存在的影响。针对物联网应用,开发了MMLPA-IoT系统。
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