An optimized method for TTSV placement with non-uniform heat sources in 3D-IC

IF 1.1 4区工程技术 Q4 THERMODYNAMICS Thermal Science Pub Date : 2023-01-01 DOI:10.2298/tsci220801021d

Feng Dai, Zhong-liang Pan

引用次数: 0

Abstract

In the past few years, thermal through silicon via (TTSV) has been experimentally investigated as an effective heat dissipation path. Although a lot of heat dissipation-related issues have been solved in three-dimensional integrated circuit (3D-IC), there are neglections in TTSV placement with non-uniform heat sources so far. In this study, a unique optimization is proposed to locate TTSV while effectively alleviating hot spots in 3D-IC. The thermal dissipation of non-uniform heat sources are studied using the finite element method. The simulation results show that the minimum temperature is reduced by 2.1% compared with peak temperature in the single-layer chip, and by 1.9% in the three-layer chip.

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3D-IC中非均匀热源TTSV的优化布置方法

在过去的几年中，热通过硅通孔(TTSV)作为一种有效的散热途径进行了实验研究。虽然三维集成电路(3D-IC)的散热问题已经得到了很好的解决，但在非均匀热源的TTSV布置方面，目前还存在一些忽视。在本研究中，提出了一种独特的优化方法来定位TTSV，同时有效缓解3D-IC中的热点。采用有限元方法研究了非均匀热源的热耗散问题。仿真结果表明，与峰值温度相比，单层芯片的最低温度降低了2.1%，三层芯片的最低温度降低了1.9%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Thermal Science 工程技术-热力学

CiteScore

2.70

自引率

29.40%

发文量

399

审稿时长

5 months

期刊介绍： The main aims of Thermal Science to publish papers giving results of the fundamental and applied research in different, but closely connected fields: fluid mechanics (mainly turbulent flows), heat transfer, mass transfer, combustion and chemical processes in single, and specifically in multi-phase and multi-component flows in high-temperature chemically reacting flows processes present in thermal engineering, energy generating or consuming equipment, process and chemical engineering equipment and devices, ecological engineering, The important characteristic of the journal is the orientation to the fundamental results of the investigations of different physical and chemical processes, always jointly present in real conditions, and their mutual influence. To publish papers written by experts from different fields: mechanical engineering, chemical engineering, fluid dynamics, thermodynamics and related fields. To inform international scientific community about the recent, and most prominent fundamental results achieved in the South-East European region, and particularly in Serbia, and - vice versa - to inform the scientific community from South-East European Region about recent fundamental and applied scientific achievements in developed countries, serving as a basis for technology development. To achieve international standards of the published papers, by the engagement of experts from different countries in the International Advisory board.