{"title":"The effects of grain structure on electromigration failure of the lead-free solder bump","authors":"Yuanxiang Zhang, L. Liang, Dongdong Zhu","doi":"10.31534/ENGMOD.2018.3.RI.06D","DOIUrl":null,"url":null,"abstract":"ENGINEERING MODELLING 31 (2018) 3, 79-93 79 The effects of grain structure on electromigration failure of the lead-free solder bump Yuanxiang Zhang(1), Lihua Liang(2), Dongdong Zhu(1) (1) Key Laboratory of Air-driven Equipment Technology of Zhejiang Province, Quzhou University, Quzhou 324000, CHINA e-mail: zhangyx@qzu.zj.cn (2) College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, CHINA","PeriodicalId":35748,"journal":{"name":"International Journal for Engineering Modelling","volume":"10 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2019-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.31534/ENGMOD.2018.3.RI.06D","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal for Engineering Modelling","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31534/ENGMOD.2018.3.RI.06D","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 1
Abstract
ENGINEERING MODELLING 31 (2018) 3, 79-93 79 The effects of grain structure on electromigration failure of the lead-free solder bump Yuanxiang Zhang(1), Lihua Liang(2), Dongdong Zhu(1) (1) Key Laboratory of Air-driven Equipment Technology of Zhejiang Province, Quzhou University, Quzhou 324000, CHINA e-mail: zhangyx@qzu.zj.cn (2) College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, CHINA
期刊介绍：
Engineering Modelling is a refereed international journal providing an up-to-date reference for the engineers and researchers engaged in computer aided analysis, design and research in the fields of computational mechanics, numerical methods, software develop-ment and engineering modelling.
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