{"title":"AMD's next generation GPU and high bandwidth memory architecture: FURY","authors":"Joe Macri","doi":"10.1109/HOTCHIPS.2015.7477461","DOIUrl":null,"url":null,"abstract":"This article consists of a collection of slides from the authors' conference presentation. Some of the topics discussed include: Overview of AMD Radeon R9 Fury; Why HBM and Die Stacking; The Journey to Fury; Performance; Form Factor Innovation.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"15 1","pages":"1-26"},"PeriodicalIF":0.0000,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"67","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE Hot Chips 27 Symposium (HCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOTCHIPS.2015.7477461","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 67
Abstract
This article consists of a collection of slides from the authors' conference presentation. Some of the topics discussed include: Overview of AMD Radeon R9 Fury; Why HBM and Die Stacking; The Journey to Fury; Performance; Form Factor Innovation.