{"title":"PREFACE: SPECIAL ISSUE OF SYMPOSIUM FLUTE 2021 ON THERMAL MANAGEMENT OF ELECTRONIC DEVICES AND COMPONENTS","authors":"B. Sikarwar, K. Singh, Balkrishna Mehta","doi":"10.1615/jenhheattransf.v29.i3.10","DOIUrl":null,"url":null,"abstract":"The International Symposium on Fluids and Thermal Engineer g, FLUTE 2021, is an international peer-reviewed academic symposium organized b y the Department of Mechanical Engineering at Amity School of Engineering & Technology, Am ity University Uttar Pradesh, India on July 22, 2021. FLUTE 2021 provides a forum to promote rapid communication and exchange ideas between researchers, scientists, and engin e rs the field of fluid and thermal engineering. The theme of FLUTE 2021 was “Thermal Managemen t of Electronic Devices and Components.” With the rapid growth of manufacturing technologies during the past decade, electronic components and devices are exposed to the developing trends for (i) multi-functionality and (ii) miniaturization that simultaneously requires larger elec tronic power and smaller chip component sizes. Consequently, there are increasing challenges for preventing electronic devices from overheating, which badly affects their working efficiency a nd lifetime. Hence, an effective thermal management approach is essential for guaranteeing the n ormal working efficiency and safety of electronic components. In general, the thermal manageme nt techniques of electronic devices and components could be classified into two categories: (i) a ctive cooling and (ii) passive cooling. However, active cooling becomes highly limited for min iaturized electronic devices because it usually requires sufficient space and additional power. I t also has the issues of high noise levels and difficulty in maintenance. For this reason, reliable pas sive cooling has become essential and attractive for improving the thermal performance and life c ycle of small electronic components. This special issue publishes the research outcomes on the th ermal management of electronic devices and components. The articles contribute to the exis ting body of knowledge and provide new insights and perspectives on the theme of FLUTE 2021. The invit d authors are those who were conducting research on a variety of technologies in var ious settings through theoretical and empirical research investigations. This special issue consists of six research articles that are extended versions of the papers presented in FLUTE 2021. Als o, the papers submitted by other renowned authors working on the theme of FLUTE 2021 were also considered. The rigorous review process of the Journal of Enhanced Heat Transfer (JEHT) was followed to reach a final decision. The first paper presents an experimental study of a phase chan ge material (PCM)-based hybrid heat sink for electronic cooling. In the second paper , an experimental investigation of the spray cooling system for next-generation electronic de vices is discussed. The third paper presents the numerical study of tube diameter effects on the solidification of PCM in a compact heat exchanger. The fourth paper proposes a study on convect ive and conjugate heat transfer efficiency enhancement over the partitioned channel within a backward-facing step using the Lattice–Boltzmann method. The fifth paper presents a new dis cret zation strategy for microchannel conjugate heat transfer modeling using the Lattice–Bol tzmann method. In the sixth paper, the authors present a study on temperature calculation for sing le-wire cables with time-varying step function excitations.","PeriodicalId":50208,"journal":{"name":"Journal of Enhanced Heat Transfer","volume":"142 1","pages":""},"PeriodicalIF":1.5000,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Enhanced Heat Transfer","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1615/jenhheattransf.v29.i3.10","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
引用次数: 0
Abstract
The International Symposium on Fluids and Thermal Engineer g, FLUTE 2021, is an international peer-reviewed academic symposium organized b y the Department of Mechanical Engineering at Amity School of Engineering & Technology, Am ity University Uttar Pradesh, India on July 22, 2021. FLUTE 2021 provides a forum to promote rapid communication and exchange ideas between researchers, scientists, and engin e rs the field of fluid and thermal engineering. The theme of FLUTE 2021 was “Thermal Managemen t of Electronic Devices and Components.” With the rapid growth of manufacturing technologies during the past decade, electronic components and devices are exposed to the developing trends for (i) multi-functionality and (ii) miniaturization that simultaneously requires larger elec tronic power and smaller chip component sizes. Consequently, there are increasing challenges for preventing electronic devices from overheating, which badly affects their working efficiency a nd lifetime. Hence, an effective thermal management approach is essential for guaranteeing the n ormal working efficiency and safety of electronic components. In general, the thermal manageme nt techniques of electronic devices and components could be classified into two categories: (i) a ctive cooling and (ii) passive cooling. However, active cooling becomes highly limited for min iaturized electronic devices because it usually requires sufficient space and additional power. I t also has the issues of high noise levels and difficulty in maintenance. For this reason, reliable pas sive cooling has become essential and attractive for improving the thermal performance and life c ycle of small electronic components. This special issue publishes the research outcomes on the th ermal management of electronic devices and components. The articles contribute to the exis ting body of knowledge and provide new insights and perspectives on the theme of FLUTE 2021. The invit d authors are those who were conducting research on a variety of technologies in var ious settings through theoretical and empirical research investigations. This special issue consists of six research articles that are extended versions of the papers presented in FLUTE 2021. Als o, the papers submitted by other renowned authors working on the theme of FLUTE 2021 were also considered. The rigorous review process of the Journal of Enhanced Heat Transfer (JEHT) was followed to reach a final decision. The first paper presents an experimental study of a phase chan ge material (PCM)-based hybrid heat sink for electronic cooling. In the second paper , an experimental investigation of the spray cooling system for next-generation electronic de vices is discussed. The third paper presents the numerical study of tube diameter effects on the solidification of PCM in a compact heat exchanger. The fourth paper proposes a study on convect ive and conjugate heat transfer efficiency enhancement over the partitioned channel within a backward-facing step using the Lattice–Boltzmann method. The fifth paper presents a new dis cret zation strategy for microchannel conjugate heat transfer modeling using the Lattice–Bol tzmann method. In the sixth paper, the authors present a study on temperature calculation for sing le-wire cables with time-varying step function excitations.
期刊介绍:
The Journal of Enhanced Heat Transfer will consider a wide range of scholarly papers related to the subject of "enhanced heat and mass transfer" in natural and forced convection of liquids and gases, boiling, condensation, radiative heat transfer.
Areas of interest include:
■Specially configured surface geometries, electric or magnetic fields, and fluid additives - all aimed at enhancing heat transfer rates. Papers may include theoretical modeling, experimental techniques, experimental data, and/or application of enhanced heat transfer technology.
■The general topic of "high performance" heat transfer concepts or systems is also encouraged.