Thickness Measurements with Multistatic Sparse Arrays

A. Keil, N. Schreiner, F. Friederich
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Abstract

Thickness measurements using terahertz waves have received great attention in the area of industrial nondestructive testing. Currently these technologies are limited to individual thickness measurements using scanning probes. Within this contribution we demonstrate that a state of the art terahertz imaging system based on a multistatic sparse array can be used to acquire real-time data und to establish thicknesses of bulk materials on an industrial scale. We are discussing extensions how to go below the inherent resolution determined by the bandwidth of the signal.
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基于多静态稀疏阵列的厚度测量
利用太赫兹波进行厚度测量在工业无损检测领域受到了广泛的关注。目前,这些技术仅限于使用扫描探头进行单个厚度测量。在这一贡献中,我们证明了基于多静态稀疏阵列的最先进的太赫兹成像系统可用于获取实时数据并在工业规模上建立块状材料的厚度。我们正在讨论扩展如何低于由信号带宽决定的固有分辨率。
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