Improved method for generation of hot working process maps of metals

IF 1 4区 工程技术 Q3 ENGINEERING, MULTIDISCIPLINARY Journal of the Chinese Institute of Engineers Pub Date : 2023-06-29 DOI:10.1080/02533839.2023.2227880
S. Tseng, Muhammad Ali, F. Qayyum, S. Guk, Christian Overhagen, C. Chao, U. Prahl
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Abstract

ABSTRACT A process map is an intelligent way of visualizing material deformation behavior under hot working conditions by encompassing the activation and deactivation of different local mechanisms. Process maps are used by engineers to optimize temperature and strain rate conditions appropriate for the highly efficient hot workability of materials. Although the calculation of process maps is well established, the present model for the analysis of instability breaks down at specific points. This study investigates the divergent behavior of the process map instability component by simplified mathematical calculations. In the mathematical model of the instability parameter, the stable transition point and unstable transition point have been defined in this article. A guide to developing the process map is described in detail with suitable numerical software with practical examples of γ-iron and Fe-5Ni. The proposed methodology provides a robust criterion for the identification of different instability regions explained by corresponding physical phenomena.
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金属热加工工艺图生成的改进方法
工艺图是一种在热加工条件下通过包含不同局部机制的激活和失活来可视化材料变形行为的智能方法。工程师使用工艺图来优化温度和应变率条件,以适合材料的高效热加工性。虽然过程图的计算已经很好地建立起来,但目前的分析不稳定性的模型在特定的点上失效了。本文通过简化数学计算,探讨了过程图不稳定分量的发散行为。在失稳参数的数学模型中,定义了稳定过渡点和不稳定过渡点。以γ-铁和Fe-5Ni为例,详细介绍了用合适的数值软件编制工艺图的方法。所提出的方法为识别由相应物理现象解释的不同不稳定区域提供了一个可靠的标准。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of the Chinese Institute of Engineers
Journal of the Chinese Institute of Engineers 工程技术-工程:综合
CiteScore
2.30
自引率
9.10%
发文量
57
审稿时长
6.8 months
期刊介绍: Encompassing a wide range of engineering disciplines and industrial applications, JCIE includes the following topics: 1.Chemical engineering 2.Civil engineering 3.Computer engineering 4.Electrical engineering 5.Electronics 6.Mechanical engineering and fields related to the above.
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