Optical In-Situ Verification of 3D-Printed Electronic Circuits

Florens Wasserfall, Daniel Ahlers, N. Hendrich
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引用次数: 8

Abstract

With 3D-Printing becoming a mainstream technology in industry, the need for online process inspection and quality control arises. In this paper, we propose an approach for optical inspection of fused deposition modeling (FDM) printing with integrated electronics. Our prototype setup combines a traditional FDM extruder with an additional extruder for conductive ink, a vacuum pick-and-place nozzle, and two cameras for object alignment and process control. We describe the camera setup, show typical printing faults encountered on our system, and explain our computer vision algorithms to detect (and repair) those faults. We also describe the integration of the inspection modules into existing slicing- and 3D-printsoftware.
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3d打印电子电路的光学原位验证
随着3d打印成为工业上的主流技术,在线过程检测和质量控制的需求出现了。本文提出了一种基于集成电子技术的熔融沉积建模(FDM)打印光学检测方法。我们的原型装置结合了一个传统的FDM挤出机,一个用于导电油墨的额外挤出机,一个真空取放喷嘴,以及两个用于物体对准和过程控制的摄像头。我们描述了相机设置,展示了我们系统中遇到的典型打印故障,并解释了我们的计算机视觉算法来检测(和修复)这些故障。我们还描述了将检测模块集成到现有的切片和3d打印软件中。
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