Ashutosh Kumar Singh, B. P. Panda, S. Mohanty, S. Nayak, M. Gupta
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引用次数: 27
Abstract
ABSTRACT The development of new polymer-based conductive adhesives with specific performances and improved conductivity are increasingly critical for thermally interface material (TIM). Epoxy resins have been widely used as a common interface material for conductive adhesives due to its well-known ability to accept wide range of fillers possibly derived from carbon, metallic or ceramic sources. These conductive fillers with high inherent thermal conductivity, together with a possibility to characterize and manipulate the system, leads to the production of thermally conductive adhesives with higher knowledge content for a number of electronics applications. GRAPHICAL ABSTRACT
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