Mode III crack approaching the wedge-shaped elastic inclusion

Victor V. Tikhomirov
{"title":"Mode III crack approaching the wedge-shaped elastic inclusion","authors":"Victor V. Tikhomirov","doi":"10.1016/j.spjpm.2017.06.001","DOIUrl":null,"url":null,"abstract":"<div><p>The problem on an antiplane semi-infinite crack approaching an elastic wedge-shaped inclusion is considered. The problem has been solved exactly using the Mellin integral transformation and the Wiener–Hopf method. The asymptotic behavior of the stress intensity factor <em>K</em><sub>III</sub> in the crack tip was studied for short distances from the crack to the inclusion vicinity. Depending on the composition parameters, the crack was shown to be stable (<em>K</em><sub>III</sub> <!-->→<!--> <!-->0) or unstable (<em>K</em><sub>III</sub> <!-->→<!--> <!-->∞). Provided that the interface has a corner point, the crack growth can be unstable (unlike the smooth interface) for some parameter values even though the crack approaches, from a soft material, a relatively harder inclusion. Alternatively, the possibility of <em>K</em><sub>III</sub> <!-->→<!--> <!-->0 exists provided the crack approaching a soft inclusion from a hard material.</p></div>","PeriodicalId":41808,"journal":{"name":"St Petersburg Polytechnic University Journal-Physics and Mathematics","volume":null,"pages":null},"PeriodicalIF":0.2000,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/j.spjpm.2017.06.001","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"St Petersburg Polytechnic University Journal-Physics and Mathematics","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2405722317300579","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"PHYSICS, MULTIDISCIPLINARY","Score":null,"Total":0}
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Abstract

The problem on an antiplane semi-infinite crack approaching an elastic wedge-shaped inclusion is considered. The problem has been solved exactly using the Mellin integral transformation and the Wiener–Hopf method. The asymptotic behavior of the stress intensity factor KIII in the crack tip was studied for short distances from the crack to the inclusion vicinity. Depending on the composition parameters, the crack was shown to be stable (KIII  0) or unstable (KIII  ∞). Provided that the interface has a corner point, the crack growth can be unstable (unlike the smooth interface) for some parameter values even though the crack approaches, from a soft material, a relatively harder inclusion. Alternatively, the possibility of KIII  0 exists provided the crack approaching a soft inclusion from a hard material.

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接近楔形弹性夹杂的III型裂纹
研究了接近弹性楔状夹杂的反平面半无限裂纹问题。利用Mellin积分变换和Wiener-Hopf方法精确地解决了这一问题。研究了裂纹尖端应力强度因子KIII在从裂纹到夹杂附近的短距离内的渐近行为。根据组成参数的不同,裂纹表现为稳定(KIII→0)或不稳定(KIII→∞)。如果界面有一个角点,那么在某些参数值下,裂纹的扩展可能是不稳定的(与光滑界面不同),即使裂纹从软材料靠近相对较硬的夹杂物。或者,如果裂纹接近硬材料的软夹杂,则存在KIII→0的可能性。
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