Thermoelastic Analysis Of Bending Problems In Fgm Plates

Abstract

It is well known that the original 3D elasticity problem in plate structures subjected to transversal loading can be converted to a 2D problem. In addition to in-plane displacements, we need to introduce the deflection and/or rotation field variables in the plate mid-plane, in order to describe displacements and deformations within the plate structure. Thus, one can develop unified formulation for bending and inplane deformation modes within the classical Kirchhoff-Love theory for bending of thin elastic plates and the shear deformation plate theories (the first order – FSDPT, and the third order TSDPT). In this paper, we extend the derivation of the 2D formulation for coupled problems of thermoelasticity in plate structures. Three material coefficients play the role in stationary problems, namely the Young modulus, coefficient of linear thermal extension and the heat conduction coefficient. The influence of continuous gradation of these coefficients on the response of the plate subjected to thermal loadings is investigated in numerical simulations. The element-free strong formulation with using meshless approximations for spatial variation of field variables is developed.