Terahertz array receivers with integrated antennas

G. Chattopadhyay, N. Llombart, Choonsup Lee, C. Jung, R. Lin, K. Cooper, T. Reck, J. Siles, E. Schlecht, A. Peralta, B. Thomas, I. Mehdi
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引用次数: 4

Abstract

Highly sensitive terahertz heterodyne receivers have been mostly single-pixel. However, now there is a real need of multi-pixel array receivers at these frequencies driven by the science and instrument requirements. In this paper we explore various receiver front-end and antenna architectures for use in multi-pixel integrated arrays at terahertz frequencies. Development of wafer-level integrated terahertz receiver front-end by using advanced semiconductor fabrication technologies has progressed very well over the past few years. Novel stacking of micro-machined silicon wafers which allows for the 3-dimensional integration of various terahertz receiver components in extremely small packages has made it possible to design multi-pixel heterodyne arrays. One of the critical technologies to achieve fully integrated system is the antenna arrays compatible with the receiver array architecture. In this paper we explore different receiver and antenna architectures for multi-pixel heterodyne and direct detector arrays for various applications such as multi-pixel high resolution spectrometer and imaging radar at terahertz frequencies.
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集成天线的太赫兹阵列接收器
高灵敏度的太赫兹外差接收器大多是单像素的。然而,由于科学和仪器的要求,现在对这些频率的多像素阵列接收器有了真正的需求。在本文中,我们探讨了用于太赫兹频率的多像素集成阵列的各种接收器前端和天线架构。近年来,采用先进半导体制造技术的晶圆级集成太赫兹接收机前端的开发取得了很好的进展。微机械硅片的新颖堆叠允许在极小的封装中对各种太赫兹接收器组件进行三维集成,这使得设计多像素外差阵列成为可能。实现全集成化系统的关键技术之一是天线阵列与接收机阵列结构的兼容。在本文中,我们探索了多像素外差和直接探测器阵列的不同接收器和天线架构,用于各种应用,如多像素高分辨率光谱仪和太赫兹频率的成像雷达。
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