New heat-resistant and soluble aramids synthesized by palladium-catalyzed carbonylation-polycondensation : Environmental benign manufacturing and material processing toward dematerialization

Y. Kubota, Shigekuni Nakada, Y. Sugi
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引用次数: 5

Abstract

As a candidate for the alternate of conventional, insoluble thermosetting resins that are matrix components of fiber reinforced plastics (FRP), soluble and heat-resistant aramids (wholly aromatic polyamides) were synthesized. To obtain rigid biphenyl-containing aramid, one-step procedure from dihalobiphenyl and aromatic diamine by palladium-catalyzed carbonylation-polycondensation was successfully applied. Reaction parameters, such as base, solvent, palladium-phosphine catalyst and CO pressure in the reaction of 2,7-dibromo-9,10-dihydrophenanthrene (1) and 4,4'-diaminodipheyl ether (2a), were very important for successful synthesis. They affected the molecular weight of resulting aramid significantly. Under optimum conditions, poly[amino-1,4-phenyleneoxy-1,4-phenyleneaminocarbonyl(9,10-dihydro-2,7-phenanthrenediyl)carbonyl] (3a) Was obtained in 99% yield with high molecular weight (polystyrene equivalent M W = 128100). The procedure was applied to some other diamines. The aramid 3a was heat-resistant and soluble in polar organic solvent. On the basis of thermal analysis, 10% weight loss temperature (T 10 ) of the aramid was 461°C. The tensile strength and tensile modulus were 48 MPa and 1.6 GPa, respectively; these properties are roughly in the same level as those of conventional unsaturated polyester resin. Judging from the data, aramid 3a is applicable for matrix of FRP. Some other aramids exhibited similar properties.
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钯催化羰基缩聚合成新型耐热可溶性芳纶:环保制造及非物质化材料加工
作为传统的不溶性热固性树脂的替代品,纤维增强塑料(FRP)的基体成分,合成了可溶性和耐热的芳纶(全芳香族聚酰胺)。采用钯催化羰基缩聚一步法,成功制备了刚性含联苯芳烃。在2,7-二溴-9,10-二氢菲(1)和4,4′-二氨基二苯醚(2a)的反应中,碱、溶剂、钯-膦催化剂和CO压力等参数对成功合成至关重要。它们显著地影响了合成芳纶的分子量。在最佳条件下,可制得聚[氨基-1,4-苯乙烯氧基-1,4-苯乙烯氨基羰基(9,10-二氢-2,7-苯乙烯二基)羰基](3a),收率99%,分子量高(聚苯乙烯当量M W = 128100)。该方法也适用于其他一些二胺。芳纶3a耐热,可溶于极性有机溶剂。热分析表明,芳纶10%失重温度(t10)为461℃。拉伸强度和拉伸模量分别为48 MPa和1.6 GPa;这些性能与常规不饱和聚酯树脂大致处于同一水平。从数据来看,芳纶3a适用于FRP的基体。其他一些芳烃也表现出类似的性质。
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