Special issue on “Artificial Intelligence and Knowledge Discovery in Concurrent Engineering”

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Abstract

In the current digital era, the data captured during a product development process will grow from a large set of existing data sources to a new set of intermediate big data in every stream from product requirements, to conceptual design into manusfctutring details. In order to process the big set of product and process data and to extract the necessary knowledge from the intermediate set of new data, it is necessary to employ the modern computing facilities, such as Artificial Intelligence (AI) schemes, knowledge discovery, machine-learning procedures and deep-learning procedures. Further, efficient handling of the digital data using the traditional approaches is tedious and time consuming. Hence, various computing procedures and facilities need to be combined with concurrent product development process and tools to handle the processing of the big data in an efficient manner. This Special Issue (SI) aims to collect the cutting edge research works related to recent advancements in the applications of AI and its associated knowledge discovery schemes from various domains, such as design, engineering, manufacturing, quality, industrial and from various industries such as business, consumer, aerospace, defense, automotive, transportation, energy, life sciences, and medical fields. Authors are encouraged to submit their extended version of the research works to be presented in “International Conference on Artificial Intelligence and Knowledge Discovery in Concurrent Engineering”, aka ICECONF 2023 to be held in Chennai India from Jan 5–7, 2023 for this special issue. The topic of interest of the SI includes;
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“并行工程中的人工智能与知识发现”特刊
在当前的数字时代,在产品开发过程中捕获的数据将从现有的大量数据源增长到从产品需求到概念设计到制作细节的每一个流中的一组新的中间大数据。为了处理大的产品和过程数据集,并从中间的新数据集中提取必要的知识,有必要使用现代计算设施,如人工智能(AI)方案、知识发现、机器学习程序和深度学习程序。此外,使用传统方法有效地处理数字数据既繁琐又耗时。因此,需要将各种计算程序和设施与并行的产品开发过程和工具相结合,以高效地处理大数据。本期特刊(SI)旨在收集与人工智能应用及其相关知识发现方案的最新进展相关的前沿研究工作,涉及各个领域,如设计、工程、制造、质量、工业以及各个行业,如商业、消费、航空航天、国防、汽车、交通、能源、生命科学和医疗领域。我们鼓励作者提交他们的研究作品的扩展版本,以在“并行工程中的人工智能和知识发现国际会议”(即ICECONF 2023)上发表,该会议将于2023年1月5日至7日在印度金奈举行。SI感兴趣的主题包括:
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