{"title":"Special issue on “Artificial Intelligence and Knowledge Discovery in Concurrent Engineering”","authors":"","doi":"10.1177/1063293x221121816","DOIUrl":null,"url":null,"abstract":"In the current digital era, the data captured during a product development process will grow from a large set of existing data sources to a new set of intermediate big data in every stream from product requirements, to conceptual design into manusfctutring details. In order to process the big set of product and process data and to extract the necessary knowledge from the intermediate set of new data, it is necessary to employ the modern computing facilities, such as Artificial Intelligence (AI) schemes, knowledge discovery, machine-learning procedures and deep-learning procedures. Further, efficient handling of the digital data using the traditional approaches is tedious and time consuming. Hence, various computing procedures and facilities need to be combined with concurrent product development process and tools to handle the processing of the big data in an efficient manner. This Special Issue (SI) aims to collect the cutting edge research works related to recent advancements in the applications of AI and its associated knowledge discovery schemes from various domains, such as design, engineering, manufacturing, quality, industrial and from various industries such as business, consumer, aerospace, defense, automotive, transportation, energy, life sciences, and medical fields. Authors are encouraged to submit their extended version of the research works to be presented in “International Conference on Artificial Intelligence and Knowledge Discovery in Concurrent Engineering”, aka ICECONF 2023 to be held in Chennai India from Jan 5–7, 2023 for this special issue. The topic of interest of the SI includes;","PeriodicalId":10680,"journal":{"name":"Concurrent Engineering","volume":"21 1","pages":"309 - 311"},"PeriodicalIF":0.0000,"publicationDate":"2022-08-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Concurrent Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1177/1063293x221121816","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In the current digital era, the data captured during a product development process will grow from a large set of existing data sources to a new set of intermediate big data in every stream from product requirements, to conceptual design into manusfctutring details. In order to process the big set of product and process data and to extract the necessary knowledge from the intermediate set of new data, it is necessary to employ the modern computing facilities, such as Artificial Intelligence (AI) schemes, knowledge discovery, machine-learning procedures and deep-learning procedures. Further, efficient handling of the digital data using the traditional approaches is tedious and time consuming. Hence, various computing procedures and facilities need to be combined with concurrent product development process and tools to handle the processing of the big data in an efficient manner. This Special Issue (SI) aims to collect the cutting edge research works related to recent advancements in the applications of AI and its associated knowledge discovery schemes from various domains, such as design, engineering, manufacturing, quality, industrial and from various industries such as business, consumer, aerospace, defense, automotive, transportation, energy, life sciences, and medical fields. Authors are encouraged to submit their extended version of the research works to be presented in “International Conference on Artificial Intelligence and Knowledge Discovery in Concurrent Engineering”, aka ICECONF 2023 to be held in Chennai India from Jan 5–7, 2023 for this special issue. The topic of interest of the SI includes;