Feasibility of Formation of Ge1-x-y Six Sny Layers With High Sn Concentration via Ion Implantation

Randall L. Holliday, Joshua M. Young, Satyabrata Singh, F. McDaniel, B. Rout
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Abstract

By increasing the Sn concentration in Ge1-ySny and Ge1-x-ySixSny systems, these materials can be tuned from indirect to direct bandgap along with increasing electronic and photonic properties. Efforts have been made to synthesize Sn-Ge and Ge-Si-Sn structures and layers to produce lower energy direct bandgap materials. Due to low solid solubility of Sn in Ge and Si-Ge layers, high concentrations of Sn are not achieved by traditional synthesis processes such as chemical vapor deposition or molecular beam epitaxy. Implantation of Sn into Si-Ge systems, followed by rapid thermal annealing or pulse laser annealing, is shown to be an attractive technique for increasing Sn concentration, which can increase efficiencies in photovoltaic applications. In this paper, dynamic ion-solid simulation results are presented. Simulations were performed to determine optimal beam energy, implantation order, and fluence for a multi-step, ion-implantation based synthesis process.
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离子注入制备高锡浓度Ge1-x-y六Sny层的可行性
通过增加Ge1-ySny和Ge1-x-ySixSny体系中的Sn浓度,这些材料可以从间接带隙调谐到直接带隙,同时增加电子和光子特性。人们努力合成Sn-Ge和Ge-Si-Sn结构和层,以生产低能量的直接带隙材料。由于Sn在Ge和Si-Ge层中的固体溶解度较低,通过化学气相沉积或分子束外延等传统合成工艺无法获得高浓度的Sn。将锡注入Si-Ge体系,然后进行快速热退火或脉冲激光退火,是提高锡浓度的一种有吸引力的技术,可以提高光伏应用的效率。本文给出了动态离子固体的模拟结果。为了确定多步骤离子注入合成过程的最佳束流能量、注入顺序和影响,进行了模拟。
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