Study of diffusion processes in contact areas of thermocouples with metals

Abstract

Diffusion processes on the contact areas of the metal-solder-semiconductor system are experimentally studied in this work. Diffusion coefficients, activation energies and pre-exponential factors in samples commutated with solders based on Pb-Sb are determined. It has been established that lead-based solder has a significantly higher inertness to thermoelectric materials. Humans are currently facing complex challenges such as rising energy costs, pollution and global warming. To reduce their consequences, scientists are concentrating on improving power generators focused on energy harvesting. Thermoelectric generators (TEGs) have demonstrated their ability to convert thermal energy directly into electricity through the Seebeck effect. Due to the unique advantages, they present, thermoelectric systems have emerged over the past decade as a promising alternative among other technologies for the production of clean energy. [1-11]. Switching is the most time-consuming and responsible operation in the manufacture of thermoelectric modules. In them, which include a significant number of junctions, failures most often occur due to broken contacts [2-8]. To prevent the harmful effects of internal mechanical stresses, in the manufacture of thermoelectric batteries, it is necessary to use a damping layer between the branch and the connecting plate [3-14]. The damping layer is made of a material with sufficient plasticity and low ohmic resistance. It is usually made from lead. The results of the research showed the advantages of using a single -wire technology for soldering with Pb - Sb eutectic solder using an anti -diffusion layer of chemically deposited nickel. In this case, the eutectic solder Pb - Sb in the contact simultaneously performs the role of a damper and a switching solder.