Enhancement of effective electromechanical coupling factor by mass loading in layered SAW device structures

Gongbin Tang, Tao Han, Akihiko Teshigahara, T. Iwaki, K. Hashimoto
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引用次数: 14

Abstract

This paper describes drastic enhancement of Ke2 by mass loading in layered SAW device structures such as the ScAlN film/Si substrate. It is shown that this phenomenon is obvious even when an amorphous SiO2 film is deposited on the top surface for temperature compensation. This enhancement is caused by SAW energy confinement to the top surface of the ScAlN layer where the IDT is placed. This Ke2 enhancement is also found when other electrode and/or substrate materials are employed.
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层状SAW器件结构中质量加载增强有效机电耦合系数
本文描述了在层状SAW器件结构(如ScAlN薄膜/Si衬底)中通过质量加载来急剧增强Ke2。结果表明,即使在顶部表面沉积无定形SiO2薄膜进行温度补偿,这种现象也很明显。这种增强是由于SAW能量限制在放置IDT的ScAlN层的上表面造成的。当使用其他电极和/或衬底材料时,也发现这种Ke2增强。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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