Focused ion beam milling of photonic crystals in bulk silicon

Wenbin Hu, D. R. Ridder, X. Tong
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Abstract

Focused ion beam (FIB) direct milling was used to fabricate photonic crystals in bulk silicon. The milling requires the sidewalls as nearly perpendicular to the slab as possible and the top profile of the holes to be smooth. The re-deposition of milled material exaggerates the hole profiles. The effects on the sidewall profile and the top periphery due to the beam current, dwell time, and the extra boundary milling have been researched. It turns out that a combination of beam current, dwell time, and milling depth has optimized the sidewalls and top periphery of the holes.
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聚焦离子束铣削块状硅光子晶体的研究
利用聚焦离子束直接铣削技术在块状硅中制备光子晶体。铣削要求侧壁尽可能垂直于板坯,孔的顶部轮廓要光滑。铣削后材料的再沉积使孔的轮廓增大。研究了光束电流、停留时间和额外边界铣削对侧壁轮廓和顶部边缘的影响。结果表明,光束电流、停留时间和铣削深度的组合优化了孔的侧壁和顶部边缘。
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10998
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