Design Concepts for Peel-Dominant Adhesive Joints in Aeronautic Applications

J. Lopes, R. Campilho, M. A. Bellali, M. Baghdadi
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Abstract

The adhesive bonding technique is employed from the aeronautical/aerospace industry to current house products. To comply with the requirements of distinct applications, different joint configurations are available to the designer. While single-lap joints (SLJ) are the most common in application and research, double-lap joints, scarf joints and T-joints find specific applications. T-joints are seldom studied in the literature, but these are used, for instance, in aircraft to bond the stiffener beams to the skin, or in the cars between the B-pillar and the rocker. Due to the high stress concentrations, T-joints often fail under average stresses much lower than the adhesive strengths, giving rise to the necessity for proper design and strength improvement methodologies. This work initially aims to validate the cohesive zone modelling (CZM) technique with experiments, and then use it to numerically evaluate and optimize the performance of T-joints subjected to peel loads. CZM is nowadays regarded as the most powerful strength prediction tool for adhesive joints, and can be a valuable tool to improve T-joints. Different features are addressed for a complete analysis: adhesive type, geometrical parameters, dual-adhesive technique for strength improvement, and composite joints. The evaluated geometrical parameters are the base adherend thickness (a), T-part thickness (t), overlap or bonding length (l) and curvature radius (r). As a result of this work, the model was successfully validated, and clear design guidelines were provided to define the ideal geometric and material (adhesive) conditions for best performance.
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航空应用中以剥离为主导的粘合接头的设计概念
粘接技术从航空/航天工业应用到目前的家用产品。为了满足不同应用的要求,设计人员可以选择不同的关节配置。在应用和研究中,单搭接(SLJ)最为常见,而双搭接、围巾接头和t型接头也有其特殊的应用。t型接头在文献中很少被研究,但它们被用于,例如,在飞机上,将加强梁连接到皮肤上,或者在汽车的b柱和摇杆之间。由于高应力集中,t型接头在平均应力远低于粘接强度的情况下往往会失效,因此需要适当的设计和强度改进方法。本工作首先旨在通过实验验证黏结区建模(CZM)技术,然后使用它来数值评估和优化t形节点在剥离荷载下的性能。CZM被认为是目前最强大的粘接强度预测工具,可以作为改进t型接头的有价值的工具。针对不同的特征进行了完整的分析:粘合剂类型,几何参数,用于提高强度的双粘合剂技术和复合接头。评估的几何参数是基础粘附厚度(a), t部分厚度(t),重叠或粘合长度(l)和曲率半径(r)。由于这项工作,该模型被成功验证,并提供了明确的设计指南,以定义最佳性能的理想几何和材料(粘合剂)条件。
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