Does the Conditioning Mode and Duration of Universal Adhesives Affect the Bonding Effectiveness to Fluorotic Enamel?

F. Siqueira, A. Armas-Vega, Alexie Izquierdo-Bucheli, Thaysa Fernandes Pinto, T. Hanzen, J. Bauer, A. Cardenas, A. Loguércio
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引用次数: 7

Abstract

PURPOSE To compare the adhesive-enamel microshear bond strength (µSBS), in situ degree of conversion (DC), and the enamel-etching pattern of universal adhesives when applied for a prolonged period in the self-etch vs the etch-and-rinse mode in fluorotic enamel. MATERIALS AND METHODS Ninety-six human molars (48 with a Thylstrup and Fejerskov index [TFI] score of 0 and 48 with TFI score of 4) were sectioned into four parts and divided into 24 experimental groups based on enamel surface (sound enamel or fluorotic enamel), adhesive (Clearfil Universal Bond, Futurabond U, iBond Universal, or Scotchbond Universal), and enamel treatment/application time (etch-and-rinse mode [ER] or self-etch mode with application times of 20 s [20SE] and 40 s [40SE]). The specimens were stored for 24 h and tested in shear at 1.0 mm/min (μSBS). Adhesive-enamel interfaces were evaluated for DC using micro-Raman spectroscopy. The enamel-etching pattern was evaluated using SEM. For each adhesive, data from µSBS and DC were analyzed separately using two-way ANOVA and Tukey's post-hoc test at α = 0.05. RESULTS On sound enamel, 40SE usually resulted in statistically similar mean µSBS (p > 0.52) and statistically significantly improved mean DC values (p < 0.001) compared with the ER mode. Moreover, significantly improved mean µSBS and DC values were obtained compared with 20SE (p < 0.01). On fluorotic enamel, there was no statistically significant difference in µSBS between the experimental groups (p > 0.76). However, for each applied adhesive, 40SE resulted in improved mean DC values compared with 20SE or ER (p < 0.001). The deepest enamel-etching pattern was obtained in ER mode, followed by 40SE in sound and fluorotic enamel. CONCLUSION Compared with ER mode, the prolonged application time of universal adhesives in SE mode in fluorotic enamel increased the DC, enhanced enamel-etching pattern and promoted similar results in terms of adhesive-enamel bond strength.
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万能胶的调理方式和使用时间对氟牙釉质的粘接效果有影响吗?
目的比较通用胶粘剂在自蚀刻和氟牙釉质蚀刻-冲洗模式下长时间应用时,胶粘剂-牙釉质微剪切结合强度(µSBS)、原位转化度(DC)和牙釉质蚀刻模式。材料和METHODSNinety-six人类的臼齿(48 Thylstrup和Fejerskov指数(TFI)得分为0和48 TFI得分4)分为四个部分,分成24个实验小组基于搪瓷表面(声音搪瓷或氟斑牙釉质)、胶粘剂(Clearfil环球债券,Futurabond U, iBond普遍,或Scotchbond通用),和搪瓷处理/应用程序时间(etch-and-rinse模式(ER)或self-etch模式与应用程序* 20 (20 se)和40年代[40 se])。试件保存24 h,在1.0 mm/min (μSBS)剪切下进行试验。用微拉曼光谱对黏合剂-牙釉质界面进行了评价。用扫描电镜对其进行了表征。对于每种粘合剂,µSBS和DC的数据分别使用双向方差分析和Tukey事后检验进行分析,α = 0.05。结果与ER模式相比,40SE模式的声牙釉质平均µSBS (p < 0.52)和平均DC值(p < 0.001)差异有统计学意义。此外,与20SE相比,平均µSBS和DC值显著提高(p < 0.01)。在氟牙釉质上,实验组之间µSBS的差异无统计学意义(p > 0.76)。然而,对于每种应用的粘合剂,与20SE或ER相比,40SE导致平均DC值提高(p < 0.001)。在ER模式下获得最深的珐琅蚀刻图案,其次是声音和氟牙釉质的40SE。结论与ER模式相比,SE模式下通用粘接剂在氟牙釉质上的应用时间延长,增加了DC,增强了珐琅-蚀刻模式,并促进了粘接剂-牙釉质结合强度的相似结果。
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