C. Kung, Hung-Yi Lin, Chin-Cheng Kuo, Cheng-Syuan Wu, Yu-Ting Chen, Meng-Wei Hsieh, Yu-Chang Hsieh, Pao-Nan Lee
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引用次数: 0
Abstract
Higher performance and smaller form factor are always the critical subjects for mobile device in recent years. To meet this demand, System-In-Package (SiP) has become a certain path for innovation and an unstoppable trend for decade. In this study, the benefits of evolving SiP with organic substrate to Fan-Out SiP (FOSiP) for new generation mobile RF module with higher performance and smaller form factor has been illustrated. A designed and manufactured FOSiP module with 6 RF devices integrated by several core features and building blocks would be demonstrated, including chip-last RDL manufacturing, carrier system, wafer level assembly and shielding sputtering.
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