Two-Dimensional Finite Element Thermal Stress Analysis of Butt Adhesive Joint in Steady Temperature State

Abstract

Thermal stresses of butt adhesive joints in steady temperature state are analyzed using a two-dimensional finite element method (FEM). The results obtained are as follows. The maximum principal thermal stress in the adhesive layer decreases when the ratio of thermal conductivity of an adhesive to that of an adherend approach I. When both adherends arc in the same temperature state, the maximum principal thermal stress in the joint decreases with a decrease of the adhesive thickness. When both adherends are in different temperature states, the maximum principal thermal stress varies with the ratio of the adherend thickness to the adhesive thickness. The maximum principal thermal stress in the joint which is subjected to the uniform temperature change AT is smaller than that in the joint in which the temperature difference of free surfaces of both the adherends is AT. In the experiments, the adhesive layer of the butt adhesive joint was modeled by an epoxide resin plate. The thermal stresses of the joints under steady temperature state were measured by two-dimensional photoelastic experiments. Fairly good agreement was seen between the numerical and the experimental results.