Inorganic Ligand-Capped Colloidal Nanocrystals for Electronic Device Application

RAN Pub Date : 2017-04-01 DOI:10.11159/icnnfc17.135
Jaeyoung Jang
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Abstract

Extended Abstract Colloidal nanocrystals can combine the advantages of crystalline inorganic semiconductors with the size-tunable electronic structure and inexpensive solution-based device fabrication.[1] They are of great interest due to these unique advantages for use in electronic and optoelectronic devices such as field-effect transistors (FETs), photovoltaic cells, and light-emitting diodes.[1-8] Efficient charge transport is crucial for high performance of nanocrystal-based electronic and optoelectronic devices.[2,3] Many practical implementations of nanocrystals are hindered by the poor electronic coupling in close-packed nanocrystal films, caused by the presence of bulky organic surface ligands. In this study, to address this fundamental problem, various types of inorganic surface ligands are introduced.[2,4,5] By using optimized inorganic surface ligands, nanocrystal solids are prepared exhibiting band-like charge transport, high photoconductivity and tunable doping level.[6] For example, we explore the temperature-dependent Hall effect of inorganically capped InAs nanocrystals. In addition, a solution-based “soldering” process is introduced to fabricate ultrahigh electron mobility (>300 cm 2 /Vs) nanocrystal solids using colloidal nanocrystals with molecular “solders”.[7,8] The high-mobility FETs were fabrcated by spin-coating a solution of Cd2Se3 2-capped CdSe nanocrystals, followed by thermal annealing. Finally, we expand the application of the NC soldering process to core−shell NCs consisting of a III−V InAs core and a CdSe shell with composition-matched Cd2Se3 2− molecular solders. Soldering CdSe shells forms nanoheterostructured material that combines high electron mobility and near-IR photoresponse.
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无机配体覆盖胶体纳米晶体在电子器件中的应用
胶体纳米晶体可以将晶体无机半导体的优点与尺寸可调的电子结构和廉价的基于溶液的器件制造相结合。[1]由于它们在电子和光电子器件(如场效应晶体管(fet)、光伏电池和发光二极管)中的独特优势,它们引起了人们的极大兴趣。[1-8]高效率的电荷输运对于纳米晶体电子和光电子器件的高性能至关重要。[2,3]由于存在体积庞大的有机表面配体,在致密的纳米晶体薄膜中电子耦合不良,阻碍了纳米晶体的许多实际实现。在本研究中,为了解决这一基本问题,介绍了各种类型的无机表面配体。[2,4,5]通过使用优化的无机表面配体,制备出具有带状电荷输运、高光导性和可调掺杂水平的纳米晶体固体[6]。例如,我们探索了无机覆盖的InAs纳米晶体的温度依赖霍尔效应。此外,还引入了一种基于溶液的“焊接”工艺,利用胶体纳米晶体和分子“焊料”制造超高电子迁移率(>300 cm 2 /Vs)的纳米晶体固体。[7,8]采用自旋涂覆Cd2Se3 - 2包覆CdSe纳米晶溶液的方法制备高迁移率场效应管,然后进行热退火。最后,我们将NC焊接工艺的应用扩展到由III−V InAs核心和CdSe外壳组成的芯壳NC,并使用成分匹配的cd2se32 -分子焊料。焊接CdSe壳形成纳米异质结构材料,结合了高电子迁移率和近红外光响应。
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