{"title":"Stoichiometry and effects of nano-sized and micro-sized fillers on an epoxy based system","authors":"V. Nguyen, A. Vaughan, P. Lewin, A. Krivda","doi":"10.1109/CEIDP.2011.6232656","DOIUrl":null,"url":null,"abstract":"Epoxy resin and its composites filled with micro-sized fillers have been commonly used in different electrical applications. A large amount of research has also considered the effects of the large interfacial areas associated with nanoscopic fillers on material properties, but little has concentrated on systems with stoichiometric proportions. This paper investigates effects of resin stoichiometry on dielectric properties, including the glass transition temperature, permittivity, and breakdown strength of an epoxy resin system and its composites filled with silica particles of different sizes.","PeriodicalId":6317,"journal":{"name":"2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena","volume":"6 1","pages":"302-305"},"PeriodicalIF":0.0000,"publicationDate":"2011-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CEIDP.2011.6232656","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
Epoxy resin and its composites filled with micro-sized fillers have been commonly used in different electrical applications. A large amount of research has also considered the effects of the large interfacial areas associated with nanoscopic fillers on material properties, but little has concentrated on systems with stoichiometric proportions. This paper investigates effects of resin stoichiometry on dielectric properties, including the glass transition temperature, permittivity, and breakdown strength of an epoxy resin system and its composites filled with silica particles of different sizes.