{"title":"A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity","authors":"Izumi Daido, Ryoichi Watanabe, Toshio Takahashi, Masateru Fukuoka","doi":"10.1109/IMPACT56280.2022.9966704","DOIUrl":null,"url":null,"abstract":"There has been strong demand to increase I/O bandwidth for higher performance of semiconductor packages [1, 2, 3, 4]. Hybrid bonding is a very important interconnect technology not only to increase the I/O bandwidth but also to reduce signal delay and inter connect power loss for next generation High Performance Computing (HPC) requirements. Also hybrid bonding technology is key technology for 3D IC (Integrated Chiplets).","PeriodicalId":13517,"journal":{"name":"Impact","volume":"99 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Impact","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT56280.2022.9966704","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
There has been strong demand to increase I/O bandwidth for higher performance of semiconductor packages [1, 2, 3, 4]. Hybrid bonding is a very important interconnect technology not only to increase the I/O bandwidth but also to reduce signal delay and inter connect power loss for next generation High Performance Computing (HPC) requirements. Also hybrid bonding technology is key technology for 3D IC (Integrated Chiplets).
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