Thermoelastic stresses in high-power CW diode laser arrays assembled on CuW and AlN submounts

IF 0.9 4区 工程技术 Q3 Engineering Quantum Electronics Pub Date : 2022-05-01 DOI:10.1070/qel18040
V. P. Gordeev, V. A. Oleshchenko, V. V. Bezotosnyi
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Abstract

Comparative results are presented of 3D-calculation for thermoelastic stress (TES) profiles in diode laser arrays (LDAs) assembled on CuW and AlN submounts (temperature compensators) and operating at a continuous-wave (CW) thermal power load of up to 220 W. For the first time, the simulation has revealed substantial differences in the maximal TES values for the arrays assembled on CuW and AlN submounts, as well as pronounced features of TES distribution in LDA assemblies, in particular, near the rear (highly reflecting) mirror of the laser diode cavity in similar geometries of temperature compensators. Results of the numerical simulation qualitatively agree with thorough measurements of spectral distributions over the LDA emitting aperture. The obtained results are interesting for mastering the production technologies of high-power devices aimed at improving their output parameters and service life.
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高功率连续波二极管激光阵列在CuW和AlN底座上的热弹性应力
在连续波(CW)热功率负载高达220 W的情况下,对装配在CuW和AlN亚基(温度补偿器)上的二极管激光阵列(LDAs)的热弹性应力(TES)曲线进行了三维计算比较。该模拟首次揭示了组装在CuW和AlN亚基上的阵列的最大TES值的显著差异,以及LDA组件中TES分布的显著特征,特别是在相似几何形状的温度补偿器中,靠近激光二极管腔的后(高反射)镜的位置。数值模拟的结果与LDA发射孔径上光谱分布的全面测量结果在定性上一致。所得结果对掌握大功率器件的生产工艺,提高其输出参数和使用寿命具有重要意义。
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来源期刊
Quantum Electronics
Quantum Electronics 工程技术-工程:电子与电气
CiteScore
3.00
自引率
11.10%
发文量
95
审稿时长
3-6 weeks
期刊介绍: Quantum Electronics covers the following principal headings Letters Lasers Active Media Interaction of Laser Radiation with Matter Laser Plasma Nonlinear Optical Phenomena Nanotechnologies Quantum Electronic Devices Optical Processing of Information Fiber and Integrated Optics Laser Applications in Technology and Metrology, Biology and Medicine.
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