A. Bardaine, P. Boy, P. Belleville, O. Acher, F. Levassort
{"title":"P1J-1 Optimized Piezoelectric Sol-Gel Composite Films for High Frequency Ultrasonic Transducers","authors":"A. Bardaine, P. Boy, P. Belleville, O. Acher, F. Levassort","doi":"10.1109/ULTSYM.2007.364","DOIUrl":null,"url":null,"abstract":"High frequency piezoelectric films were prepared using the composite sol-gel technique, by mixing PZT sol and laboratory-made powders, free-cracked thick films were deposited by dip-coating on silicon, alumina and porous PZT substrates. Only 3 composite layers and few final infiltrations were used to prepare 40 mum thick films. Reproducible electromechanical properties, i.e. thickness coupling coefficients around 40%, were obtained after a poling at 15V mum in an oil bath at 170degC. A pulse echo response was measured with a 35 mum thick film deposited on a porous PZT substrate. The corresponding characteristics are an axial resolution of 45 mum (with a bandwidth at 80*%) at -6dB and a center frequency of 20 MHz. These results showed that the composite sol-gel process is a good candidate to produce piezoelectric films with a thickness of few tens of microns with a minimization of fabrication steps.","PeriodicalId":6355,"journal":{"name":"2007 IEEE Ultrasonics Symposium Proceedings","volume":"25 1","pages":"1448-1451"},"PeriodicalIF":0.0000,"publicationDate":"2007-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Ultrasonics Symposium Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ULTSYM.2007.364","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
High frequency piezoelectric films were prepared using the composite sol-gel technique, by mixing PZT sol and laboratory-made powders, free-cracked thick films were deposited by dip-coating on silicon, alumina and porous PZT substrates. Only 3 composite layers and few final infiltrations were used to prepare 40 mum thick films. Reproducible electromechanical properties, i.e. thickness coupling coefficients around 40%, were obtained after a poling at 15V mum in an oil bath at 170degC. A pulse echo response was measured with a 35 mum thick film deposited on a porous PZT substrate. The corresponding characteristics are an axial resolution of 45 mum (with a bandwidth at 80*%) at -6dB and a center frequency of 20 MHz. These results showed that the composite sol-gel process is a good candidate to produce piezoelectric films with a thickness of few tens of microns with a minimization of fabrication steps.