J. Boyer, Ari N. Blumer, Zak H. Blumer, Francisco A. Rodriguez, Daniel L. Lepkowski, S. Ringel, T. Grassman
{"title":"Development of Low-TDD GaAsyP1-y/GaP/Si Metamorphic Materials for High-Efficiency III-V/Si Photovoltaics","authors":"J. Boyer, Ari N. Blumer, Zak H. Blumer, Francisco A. Rodriguez, Daniel L. Lepkowski, S. Ringel, T. Grassman","doi":"10.1109/PVSC45281.2020.9300803","DOIUrl":null,"url":null,"abstract":"Metamorphic III-V/Si materials with low threading dislocation density (TDD) are critical to realizing high-efficiency III-V/Si multijunction photovoltaics. In pursuit of a dual junction III-V/Si design with a GaAs0.75P0.25 top junction epitaxially integrated on a Si bottom junction, we report on progress made in the development of GaP/Si and GaAsyPl-y/Si materials with significantly reduced TDD. Using a tightly integrated study of fundamental dislocation dynamics, rapid electron microscopy based feedback on dislocation populations, and MOCVD process development, we have fully re-engineered the GaP on Si growth process. Our new approach results in a TDD of 7x104 cm−2 for 50 nm thick films. Implementation of a novel dislocation glide enhancing heterostructure then enabled subsequent growth of fully-relaxed, 500 nm total thickness n-GaP with a TDD of 2.4×106 cm−2. When applied to the production of full GaAs0.75P0.25/Si tandem solar cell structures, but without any significant optimization thus far, this low TDD is effectively maintained, yielding a terminal TDD of only 3.0x106 cm−2, sufficient to support high photovoltaic performance.","PeriodicalId":6773,"journal":{"name":"2020 47th IEEE Photovoltaic Specialists Conference (PVSC)","volume":"37 1","pages":"1680-1682"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 47th IEEE Photovoltaic Specialists Conference (PVSC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PVSC45281.2020.9300803","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Metamorphic III-V/Si materials with low threading dislocation density (TDD) are critical to realizing high-efficiency III-V/Si multijunction photovoltaics. In pursuit of a dual junction III-V/Si design with a GaAs0.75P0.25 top junction epitaxially integrated on a Si bottom junction, we report on progress made in the development of GaP/Si and GaAsyPl-y/Si materials with significantly reduced TDD. Using a tightly integrated study of fundamental dislocation dynamics, rapid electron microscopy based feedback on dislocation populations, and MOCVD process development, we have fully re-engineered the GaP on Si growth process. Our new approach results in a TDD of 7x104 cm−2 for 50 nm thick films. Implementation of a novel dislocation glide enhancing heterostructure then enabled subsequent growth of fully-relaxed, 500 nm total thickness n-GaP with a TDD of 2.4×106 cm−2. When applied to the production of full GaAs0.75P0.25/Si tandem solar cell structures, but without any significant optimization thus far, this low TDD is effectively maintained, yielding a terminal TDD of only 3.0x106 cm−2, sufficient to support high photovoltaic performance.