Development of Low-TDD GaAsyP1-y/GaP/Si Metamorphic Materials for High-Efficiency III-V/Si Photovoltaics

J. Boyer, Ari N. Blumer, Zak H. Blumer, Francisco A. Rodriguez, Daniel L. Lepkowski, S. Ringel, T. Grassman
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Abstract

Metamorphic III-V/Si materials with low threading dislocation density (TDD) are critical to realizing high-efficiency III-V/Si multijunction photovoltaics. In pursuit of a dual junction III-V/Si design with a GaAs0.75P0.25 top junction epitaxially integrated on a Si bottom junction, we report on progress made in the development of GaP/Si and GaAsyPl-y/Si materials with significantly reduced TDD. Using a tightly integrated study of fundamental dislocation dynamics, rapid electron microscopy based feedback on dislocation populations, and MOCVD process development, we have fully re-engineered the GaP on Si growth process. Our new approach results in a TDD of 7x104 cm−2 for 50 nm thick films. Implementation of a novel dislocation glide enhancing heterostructure then enabled subsequent growth of fully-relaxed, 500 nm total thickness n-GaP with a TDD of 2.4×106 cm−2. When applied to the production of full GaAs0.75P0.25/Si tandem solar cell structures, but without any significant optimization thus far, this low TDD is effectively maintained, yielding a terminal TDD of only 3.0x106 cm−2, sufficient to support high photovoltaic performance.
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高效III-V/Si光伏用低tdd GaAsyP1-y/GaP/Si变质材料的研制
具有低螺纹位错密度(TDD)的变质III-V/Si材料是实现高效III-V/Si多结光伏发电的关键。在追求双结III-V/Si设计中,GaAs0.75P0.25顶部结外延集成在Si底部结上,我们报告了显著降低TDD的GaP/Si和GaAsyPl-y/Si材料的开发进展。通过对基本位错动力学、基于位错种群反馈的快速电子显微镜和MOCVD工艺发展的紧密集成研究,我们完全重新设计了Si生长过程中的GaP。我们的新方法导致50nm厚薄膜的TDD为7x104 cm−2。实现了一种新的位错滑动增强异质结构,随后生长出了完全松弛的总厚度为500 nm的n-GaP, TDD为2.4×106 cm−2。当应用于生产全GaAs0.75P0.25/Si串联太阳能电池结构时,但迄今为止没有任何显著的优化,这种低TDD被有效地保持,产生的终端TDD仅为3.0 × 106 cm−2,足以支持高光伏性能。
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