Effect of Curing Agents on Electrical Properties of Low-Temperature Curing Conductive Coatings and Thermodynamic Analysis

Junjie Shu, Wang Yang, Bei Guo, Qin Weihua, Liu Lanxuan, Liu Xiusheng
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引用次数: 1

Abstract

Silver-based high-conductivity coatings are used in many advanced manufacturing equipment and components, and existing coatings require high-temperature curing. This paper studies the effects of different curing agents on the electrical properties of low-temperature curing (<100 °C) conductive coatings, and analyzes the effects of different curing temperatures and curing time on the surface resistance, square resistance and resistivity of conductive coatings. The response surface method in Design Expert was used to construct the model, and the curing thermodynamics of different curing agents were analyzed by DSC. It was found that curing agents with lower Tm and activation energy, higher pre-exponential factor and more flexible segments are beneficial to the preparation of highly conductive coatings.
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固化剂对低温固化导电涂料电性能的影响及热力学分析
银基高导电性涂料用于许多先进的制造设备和部件,现有的涂料需要高温固化。本文研究了不同固化剂对低温固化(<100℃)导电涂料电性能的影响,分析了不同固化温度和固化时间对导电涂料表面电阻、方电阻和电阻率的影响。采用Design Expert软件中的响应面法建立模型,采用DSC分析了不同固化剂的固化热力学。研究发现,低Tm和活化能、高指前因子和多柔性段的固化剂有利于制备高导电涂料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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