Analisis pengendalian kualitas produk keripik tempe Deny menggunakan pendekatan six sigma DMAIC terintegrasi fuzzy FMEA [Analysis of the quality control of Deny's tempe chips using a six sigma DMAIC-integrated fuzzy FMEA approach]

S. Mustaniroh, N. Prabaningtias
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Abstract

Deny Tempe Chips is one of the leading MSME chips products in Malang City. The tighter business competition encourages MSMEs to increase their competitive advantage through increasing production quality and minimizing production defects. The purpose of the study was to identify and analyze the factors causing defects in the production of tempeh chips. The research uses the six sigma DMAIC (define, measure, improve, analyze, control) method with fuzzy FMEA integration. The results showed that highest defect percentage as the main priority for improving the production process (CTQ) was oily tempe chips (82.04%). The processing capability of frying tempeh chips has a final yield value of 64.87%. The frying process sigma value of 1.88 was very uncompetitive  level and required process improvement. The sources of the problems in the frying process  were human factors, methods, and production facilities. The value of FRPN as the highest risk priority for tempe chips product defects was the limited number of skilled workers in the frying process that affected the number of defects in tempeh products. The corrective action strategy proposed was human resource planning to meet the needs of the SME workforce, including the provision of training, scheduling production supervision, and adding skilled workers in the production process.Keywords: product defects, Deny tempe chips, six sigma DMAIC method, quality control.
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denytempe芯片是玛琅市领先的MSME芯片产品之一。日趋激烈的商业竞争促使中小微企业通过提高生产质量和减少生产缺陷来增加竞争优势。本研究的目的是找出并分析造成豆豉片生产缺陷的因素。本研究采用模糊FMEA集成的六西格玛DMAIC(定义、测量、改进、分析、控制)方法。结果表明:作为改进生产工艺(CTQ)主要优先事项的缺陷率最高的是含油试样(82.04%);油炸豆豉片的加工能力最终得率值为64.87%。油炸过程σ值为1.88,是非常不具有竞争力的水平,需要改进工艺。油炸过程中出现问题的根源是人为因素、油炸方法和生产设备。FRPN作为豆豉产品缺陷的最高风险优先级的价值是,油炸过程中技术工人的数量有限,影响豆豉产品缺陷的数量。提出的纠正措施策略是人力资源规划,以满足中小企业劳动力的需求,包括提供培训,安排生产监督,并在生产过程中增加熟练工人。关键词:产品缺陷,反温度芯片,六西格玛DMAIC法,质量控制。
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