{"title":"The Deep Etching Process Based on Parallel Laser Direct Writing System","authors":"Jin Hu, D. Pu, L. S. Chen","doi":"10.4028/www.scientific.net/KEM.426-427.265","DOIUrl":null,"url":null,"abstract":"Due to the high cost-effectiveness, extra flexibility, and short production cycle, laser direct writing system as a kind of maskless lithography technology has been widely used in the fields of micro-nano-manufacturing. The working principle of the parallel laser direct writing system based on DMD(Digital Micromirror Device) is introduced. A novel negative photoresist -- dry film photoresist is adopted into the study of deep etching for the fabrication of the micro mold. The experimental results show that: the whole process is convenient, efficient and flexible; the precision of the 2-D patterning and the depth of etching is reliable.","PeriodicalId":17714,"journal":{"name":"Key Engineering Materials","volume":"37 1","pages":"265 - 269"},"PeriodicalIF":0.0000,"publicationDate":"2010-01-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Key Engineering Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4028/www.scientific.net/KEM.426-427.265","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Due to the high cost-effectiveness, extra flexibility, and short production cycle, laser direct writing system as a kind of maskless lithography technology has been widely used in the fields of micro-nano-manufacturing. The working principle of the parallel laser direct writing system based on DMD(Digital Micromirror Device) is introduced. A novel negative photoresist -- dry film photoresist is adopted into the study of deep etching for the fabrication of the micro mold. The experimental results show that: the whole process is convenient, efficient and flexible; the precision of the 2-D patterning and the depth of etching is reliable.