{"title":"STUDY OF SUBSTRATE CONDUCTANCE EFFECT ON COOLING OF ELECTRONIC COMPONENTS","authors":"Shankar Durgam","doi":"10.5098/hmt.18.49","DOIUrl":null,"url":null,"abstract":"This article explores experimentally and numerically the effect of conductance on cooling of electronic chips by forced air flow in a vertical channel for thermal control. Experiments are conducted using substrates of FR4, bakelite, copper clad board (single layer) equipped with aluminum heat sources at uniform heat fluxes of 1000, 2000, and 3000 W/m 2 at 500 ≤ Re ≤ 1500. Computer simulations are performed to validate experimental results using a finite element method based COMSOL Multiphysics 4.3b software and the results are in agreements of below 10%. The temperatures obtained showed high thermal conductance copper clad boards (CCBs) are very low compared to FR4 and bakelite substrates. Results showed that FR4 and bakelite are unsuitable for airflow velocity of 0.6 m/s and heat flux of 3000 W/m 2 . However, the temperature variation between single and multilayer CCB is 3 to 4 ◦ C . The temperature reduction using CCB is 10 ◦ C compared to FR4 and bakelite.","PeriodicalId":46200,"journal":{"name":"Frontiers in Heat and Mass Transfer","volume":null,"pages":null},"PeriodicalIF":1.1000,"publicationDate":"2022-08-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Frontiers in Heat and Mass Transfer","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.5098/hmt.18.49","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"THERMODYNAMICS","Score":null,"Total":0}
引用次数: 0
Abstract
This article explores experimentally and numerically the effect of conductance on cooling of electronic chips by forced air flow in a vertical channel for thermal control. Experiments are conducted using substrates of FR4, bakelite, copper clad board (single layer) equipped with aluminum heat sources at uniform heat fluxes of 1000, 2000, and 3000 W/m 2 at 500 ≤ Re ≤ 1500. Computer simulations are performed to validate experimental results using a finite element method based COMSOL Multiphysics 4.3b software and the results are in agreements of below 10%. The temperatures obtained showed high thermal conductance copper clad boards (CCBs) are very low compared to FR4 and bakelite substrates. Results showed that FR4 and bakelite are unsuitable for airflow velocity of 0.6 m/s and heat flux of 3000 W/m 2 . However, the temperature variation between single and multilayer CCB is 3 to 4 ◦ C . The temperature reduction using CCB is 10 ◦ C compared to FR4 and bakelite.
期刊介绍：
Frontiers in Heat and Mass Transfer is a free-access and peer-reviewed online journal that provides a central vehicle for the exchange of basic ideas in heat and mass transfer between researchers and engineers around the globe. It disseminates information of permanent interest in the area of heat and mass transfer. Theory and fundamental research in heat and mass transfer, numerical simulations and algorithms, experimental techniques and measurements as applied to all kinds of current and emerging problems are welcome. Contributions to the journal consist of original research on heat and mass transfer in equipment, thermal systems, thermodynamic processes, nanotechnology, biotechnology, information technology, energy and power applications, as well as security and related topics.
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