Hoc Nguyen Quang, Hien Nguyen Duc, Hoa Nguyen Thi, H. Le Lan, Le Nguyen Ngoc
{"title":"Diffusion in metals Au, Cu, and interstitial alloys AuSi, CuSi","authors":"Hoc Nguyen Quang, Hien Nguyen Duc, Hoa Nguyen Thi, H. Le Lan, Le Nguyen Ngoc","doi":"10.18173/2354-1059.2022-0004","DOIUrl":null,"url":null,"abstract":"The paper performs numerically the vacancy activation volume, the activation energy, the pre-exponential factor, and the diffusion coefficient for metals Au, Cu, and alloys AuSi, CuSi in the interval of the concentration of interstitial atoms from zero to 4%, in the interval of temperature from 700 to 1873 K, in the interval of pressure from zero to 180 GPa and the interval of strain from zero to 5%. The paper determines the dependence of the diffusion coefficient on pressure and stress for above mentioned metals and alloys. SMM numerical results show that the Arrhenius law is satisfied for metals and interstitial alloys at different pressures and concentrations of interstitial atoms. SMM numerical results for Au at T = 1000 K and T = 1250 K and at zero pressure are in good agreement with experiments for the activation energy (errors are below 10%) and agree in terms of magnitude for the pre-exponential factor and the diffusion coefficient. SMM numerical results of the diffusion coefficient for Au in the interval of temperature from 977 to 1321 K and for Cu in the interval of temperature from 933.95 to 1336.15 K are compared with experiments and other calculations and there are rather good agreement in terms of magnitude. SMM numerical results of the activation volume of Au and Cu agree well with other calculations. SMM numerical results for diffusion quantities of interstitial alloys AuSi, CuSi in different temperatures, pressures, stresses, and concentrations of interstitial atoms anticipate and orient experiments in the future.","PeriodicalId":17007,"journal":{"name":"Journal of Science Natural Science","volume":"6 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2022-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Science Natural Science","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.18173/2354-1059.2022-0004","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The paper performs numerically the vacancy activation volume, the activation energy, the pre-exponential factor, and the diffusion coefficient for metals Au, Cu, and alloys AuSi, CuSi in the interval of the concentration of interstitial atoms from zero to 4%, in the interval of temperature from 700 to 1873 K, in the interval of pressure from zero to 180 GPa and the interval of strain from zero to 5%. The paper determines the dependence of the diffusion coefficient on pressure and stress for above mentioned metals and alloys. SMM numerical results show that the Arrhenius law is satisfied for metals and interstitial alloys at different pressures and concentrations of interstitial atoms. SMM numerical results for Au at T = 1000 K and T = 1250 K and at zero pressure are in good agreement with experiments for the activation energy (errors are below 10%) and agree in terms of magnitude for the pre-exponential factor and the diffusion coefficient. SMM numerical results of the diffusion coefficient for Au in the interval of temperature from 977 to 1321 K and for Cu in the interval of temperature from 933.95 to 1336.15 K are compared with experiments and other calculations and there are rather good agreement in terms of magnitude. SMM numerical results of the activation volume of Au and Cu agree well with other calculations. SMM numerical results for diffusion quantities of interstitial alloys AuSi, CuSi in different temperatures, pressures, stresses, and concentrations of interstitial atoms anticipate and orient experiments in the future.