{"title":"Two stages' performance analysis of Taiwanese IC design industry: a dynamic network slacks-based data envelopment analysis approach","authors":"Ching‐Cheng Lu, Xiang Chen, Shi‐Wen Lee, Shao-Yin Hsu, Kuo-Wei Chou","doi":"10.1504/ijtm.2022.10047517","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":13637,"journal":{"name":"Int. J. Technol. Manag.","volume":"19 1","pages":"93-123"},"PeriodicalIF":0.0000,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Int. J. Technol. Manag.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1504/ijtm.2022.10047517","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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