Electrolytic stainproofing of copper foils for printed circuit applications

K.N. Srinivasan, N.V. Shanmugam, M. Selvam, S. John, B.A. Shenoi
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Abstract

This paper describes electrolytic stainproofing of copper foils in chromic acid solution containing suitable additives to produce a very thin protective film. The quality of stainproofing was checked by a tarnish resistance test, a solderability test and an etchability test. The treatment also offers good protection to copper and its alloys for very many applications in day to day life. The optimum bath composition consists of chromic acid 10 g 1-1 and acetic acid 5 g l-1 and operates at a cathodic current density of 2.5 A dm-2 for 30 s at 30 °C.

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印刷电路用铜箔的电解防腐
本文介绍了在铬酸溶液中对铜箔进行电解染色的方法。铬酸溶液中含有合适的添加剂,可以形成一层极薄的保护膜。通过抗污性试验、可焊性试验和耐蚀性试验来检查防污质量。该处理还为铜及其合金在日常生活中的许多应用提供了良好的保护。最佳浴液组合由铬酸10 g -1和醋酸5 g -1组成,在30°C下,阴极电流密度为2.5 a dm-2,运行30 s。
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