Copper Ion Doped Mullite Composite in Poly (vinylidene Fluoride) Matrix: Effect on Microstructure, Phase Behavior and Electrical Properties

K. Halder, B. Paul, B. Bagchi, A. Bhattacharya, Sukhen Das
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引用次数: 8

Abstract

Highly crystallized copper ion doped mullite composites have been synthesized at 1100°C and 1400°C via sol-gel technique with five different strengths of copper ion and was incorporated in poly-vinylidene fluoride (PVDF) to make doped mullite composite/polymer films. We have studied the effects of this dopant on microstructure, phase transformation, and electrical properties of the polymer films over a wide range of frequency from 1.0 KHz to 2.0 MHz. Characterizations were done by various analytical tools at room temperature. Prominent mullite phases were observed from XRD, FTIR spectroscopy and FESEM characterization of composite polymer. The concentration of the dopant and the sintering temperature were found to be the two basic factors which affect the phase transition of the polymer. The composite film showed maximum dielectric constant of 19.96 at 1 KHz for 1.2M concentration of copper ion doped mullite sintered at 1400°C, compared to 3.09 for the pure polymer. Furthermore, both dielectric constant and electrical conductivity of the composite were found to be highly frequency and temperature dependent. After doping, the A.C. conductivity of the composite was found to increase with increasing temperature following Jonscher’s power law and the electrical resistivity reduced too. Moreover, the results revealed that the phase behaviors and micro structural changes of the copper ion doped mullite composite/polymer film affected its electrical properties with possible impact on its applications.
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聚偏氟乙烯基中铜离子掺杂莫来石复合材料的微观结构、相行为和电学性能的影响
在1100°C和1400°C温度下,采用溶胶-凝胶技术合成了5种不同强度铜离子的高结晶铜离子掺杂莫来石复合材料,并将其掺入聚偏氟乙烯(PVDF)中制备了掺杂莫来石复合/聚合物薄膜。我们在1.0 KHz到2.0 MHz的频率范围内研究了这种掺杂剂对聚合物薄膜的微观结构、相变和电性能的影响。在室温下用各种分析工具进行表征。通过XRD、FTIR和FESEM表征,观察到复合聚合物的莫来石相明显。发现掺杂剂的浓度和烧结温度是影响聚合物相变的两个基本因素。当铜离子掺杂的莫来石浓度为1.2M,烧结温度为1400°C时,复合膜在1 KHz时的最大介电常数为19.96,而纯聚合物的介电常数为3.09。此外,复合材料的介电常数和电导率都与频率和温度密切相关。掺杂后,复合材料的交流电导率随温度升高而增大,符合jonscher幂定律,电阻率降低。此外,研究结果还揭示了铜离子掺杂莫来石复合聚合物薄膜的相行为和微观结构变化会影响其电学性能,并可能影响其应用。
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