Changes in mechanical properties of micron-sized single-crystal-silicon film at high temperature

Abstract

The effects of temperature on the mechanical properties of micron-sized single-crystal-silicon (SCS) film were investigated using an "on-chip" tensile test. Young's modulus slightly decreased as the test temperature increased. The fracture stress decreased to 1.78 GPa at 773 K, the value is about 32 % of that at room temperature. The stress-strain relationship of SCS film at 773 K showed elastic-plastic deformation, and we observed crossed slip lines on the side surface of the fractured specimen. The fracture behavior of micron-sized silicon film changed in a temperature range from 673 K to 773 K.