Y. Geng, Yijie Ban, Xu Li, Yi Zhang, K. Song, Yanlin Jia, B. Tian, Meng Zhou, Yong Liu, A. Volinsky
{"title":"Excellent Mechanical Properties and High Electrical Conductivity of Cu-Co-Si-Ti Alloy Due to Multiple Strengthening","authors":"Y. Geng, Yijie Ban, Xu Li, Yi Zhang, K. Song, Yanlin Jia, B. Tian, Meng Zhou, Yong Liu, A. Volinsky","doi":"10.2139/ssrn.3782845","DOIUrl":null,"url":null,"abstract":"High performance copper alloys are widely used in electrical, electronic, aerospace fields welcomed due to their high electrical conductivity and excellent mechanical properties. At present work, we proposed a new class of Cu-Co-Si-Ti alloy by incorporating the multiple alloying elements, resulting in the multiple strengthening during heat treatment. The achievement of solution strengthening, deformation strengthening and dual-nanoprecipitation strengthening leaded to the Cu-Co-Si-Ti alloy with excellent tensile strength (617.9 MPa) and high electrical conductivity (41.7% IACS) by the optimum process of 50% cold rolling and aging at 500 °C for 30 min. EBSD was used to analyze the microstructure and texture evolution during the aging process. Moreover, it was found that the volume fraction of Goss, Brass, copper and S texture had close connections with the mechanical properties. By comparing with the contributions of multiple strengthening mechanisms, dual-nanoprecipitation strengthening contributed quite a lot due to the nanoprecipitation of Co2Si and Cu4Ti.","PeriodicalId":18341,"journal":{"name":"Materials Science eJournal","volume":"30 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2021-02-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science eJournal","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2139/ssrn.3782845","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 15
Abstract
High performance copper alloys are widely used in electrical, electronic, aerospace fields welcomed due to their high electrical conductivity and excellent mechanical properties. At present work, we proposed a new class of Cu-Co-Si-Ti alloy by incorporating the multiple alloying elements, resulting in the multiple strengthening during heat treatment. The achievement of solution strengthening, deformation strengthening and dual-nanoprecipitation strengthening leaded to the Cu-Co-Si-Ti alloy with excellent tensile strength (617.9 MPa) and high electrical conductivity (41.7% IACS) by the optimum process of 50% cold rolling and aging at 500 °C for 30 min. EBSD was used to analyze the microstructure and texture evolution during the aging process. Moreover, it was found that the volume fraction of Goss, Brass, copper and S texture had close connections with the mechanical properties. By comparing with the contributions of multiple strengthening mechanisms, dual-nanoprecipitation strengthening contributed quite a lot due to the nanoprecipitation of Co2Si and Cu4Ti.