Atomic motion of copper in solid Au:xCu alloys studied by nuclear magnetic resonance

A. Hackmann, O. Kanert, H. Kolem, B. Michel, B. Gunther
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引用次数: 1

Abstract

The atomic diffusion of Cu in solid Au:xCu alloys (x=5.7, 8.2, 9.1, 10.4, 13.2, 17.3 at.%) has been studied by means of solute (63Cu) nuclear spin relaxation (NSR) experiments in the rotating frame (T1p) between ambient temperature and 1100 K. Surprisingly, two distinct diffusion-induced maxima in the relaxation rate could be observed. The high-temperature mechanism around 950 K corresponds to the translational diffusion of Cu in the solid solution phase, as is suggested by comparison with tracer diffusion data. The second relaxation mechanism occurs at fairly low temperatures ( approximately=700 K) with a maximum intensity around 8 at.% Cu. The origin of this contribution to the diffusional NSR rate is not quite clear. The authors attribute it to a short-range ordering effect of Cu atoms in the Au matrix. The activation enthalpies of both types of atomic motion depend only slightly on the Cu concentration.
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核磁共振研究固体Au:xCu合金中铜的原子运动
采用溶质(63Cu)核自旋弛豫(NSR)实验,研究了Cu在室温至1100k之间的Au:xCu固体合金(x=5.7, 8.2, 9.1, 10.4, 13.2, 17.3 at.%)中的原子扩散。令人惊讶的是,可以观察到两个不同的扩散诱导的弛豫速率最大值。与示踪剂扩散数据的对比表明,950 K左右的高温机制对应于Cu在固溶体中的平移扩散。第二种弛豫机制发生在相当低的温度下(约=700 K),最大强度约为8at。%铜。这种对扩散NSR率贡献的来源尚不十分清楚。作者将其归因于Au基体中Cu原子的短程有序效应。两种原子运动的激活焓与Cu浓度的关系不大。
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