Compressive imaging applied to infrared-based semiconductor failure analysis

Ting Sun, Gary Woods, K. Kelly
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Abstract

We present IR emission images obtained from semiconductor devices using compressive sensing mathematics combined with a single-element infrared photon detector as method of defect detection. High signal to noise ratio, robust measurements and fast acquisition have make compressive imaging a strong supplement to traditional IR analysis systems.
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压缩成像在红外半导体失效分析中的应用
我们提出了利用压缩感知数学和单元素红外光子探测器相结合的方法从半导体器件中获得红外发射图像作为缺陷检测方法。高信噪比、鲁棒测量和快速采集使压缩成像成为传统红外分析系统的有力补充。
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