Galvanic corrosion of dental amalgams in contact with titanium in terms of released ions : Biomaterials and bioengineering

Y. Takada, Shi-Duk Lim, K. Asami, K. Kim, O. Okuno
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引用次数: 4

Abstract

Galvanic corrosion between dental amalgams and titanium was examined in terms of released ions. The ions released from the dental amalgams in contact with titanium at surface area ratios of titanium/amalgam in a range of 1/10-10/1 were quantitatively analyzed after being immersed in 0.9mass% sodium chloride solution at 310K for 6.05 x 10 5 s. The potentials and the anodic polarization curves were also measured under the same conditions. Furthermore, the amalgam surfaces after immersion were analyzed using WDS. Each potential of the conventional amalgams was always lower than that of titanium, though each potential of the high-copper amalgam was reversed in the early stage of immersion and was also lower. When the surface area ratio did not increase to over 1/1, each total amount of ions released from the amalgams in contact with titanium was a little larger or smaller than that released from amalgams not in contact with titanium. However, tin and copper ions released from the conventional amalgams and the high-copper amalgam, respectively, increased greatly when the ratio grew to 10/1. Each amount of released ions with titanium, except mercury ions, was approximated by the equation W with = a x (W without ) b , where the coefficients a and b are constant and W with and W without mean each amount of the released ions with and without titanium, respectively. The coefficient b probably relied on the surface area ratio and immersion time. When the ratio grew to 10/1, the amount of released ions with titanium, except mercury ions, could be shown by the equation W with = a x (W without ) at a = 4.202-9.982. Since the contact with titanium seemed to drastically make the amount of mercury ions decrease, the mercury ions did not fit this equation. These results indicated a risk of galvanic corrosion between dental amalgams and titanium with a large surface area ratio.
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牙汞合金与钛接触的电偶腐蚀释出离子:生物材料和生物工程
从释放离子的角度研究了牙科汞合金与钛之间的电偶腐蚀。在质量分数为0.9 %的氯化钠溶液中浸泡6.05 x 10.5 s后,定量分析钛与牙汞合金在钛/汞合金表面积比为1/10 ~ 10/1范围内接触钛时所释放的离子。测定了在相同条件下的电势和阳极极化曲线。此外,用WDS对浸渍后的汞合金表面进行了分析。常规汞合金的各电势始终低于钛合金,而高铜汞合金的各电势在浸渍初期相反,也低于钛合金。当表面积比未增加到1/1以上时,与钛接触的汞合金释放的各离子总量均略大于或小于未与钛接触的汞合金释放的离子总量。而当比例增加到10/1时,普通汞合金和高铜汞合金释放的锡离子和铜离子均显著增加。除汞离子外,各含钛离子的释放量均近似为公式W with = a x (W without) b,其中系数a和b为常数,W with和W without分别表示含钛离子和不含钛离子的释放量。系数b可能取决于表面积比和浸泡时间。当比例增大到10/1时,在a = 4.202 ~ 9.982时,除汞离子外,有钛的离子的释放量可以用方程W with = a x (W without)表示。由于与钛的接触似乎使汞离子的数量急剧减少,所以汞离子不符合这个方程。这些结果表明,大表面积比的牙科汞合金与钛之间存在电偶腐蚀的风险。
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