{"title":"Thermally induced interface bond failure of nickel deposited on aluminium","authors":"L. Révay","doi":"10.1016/0300-9416(75)90006-1","DOIUrl":null,"url":null,"abstract":"<div><p>Annealing in the range 225–550 °C increases the bonding forces between Ni-Al couples. Compressive stresses arise in nickel deposits owing to the different thermal expansion. However, the increase of annealing time reduces the stress level until bond failure initiates. The apparent bonding energy is estimated as 0.7 eV.</p></div>","PeriodicalId":100399,"journal":{"name":"Electrodeposition and Surface Treatment","volume":"3 4","pages":"Pages 283-288"},"PeriodicalIF":0.0000,"publicationDate":"1975-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0300-9416(75)90006-1","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrodeposition and Surface Treatment","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/0300941675900061","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Annealing in the range 225–550 °C increases the bonding forces between Ni-Al couples. Compressive stresses arise in nickel deposits owing to the different thermal expansion. However, the increase of annealing time reduces the stress level until bond failure initiates. The apparent bonding energy is estimated as 0.7 eV.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
