Wang Zhao-yun, J. Lei, Yang Jia-qiang, Lian Wei-qing, Zhang Dong-ping, Yan G Fang-zu, Sun Shi-gang
{"title":"Studies and Progresses on Hole Metallization in High-density interconnected Printed Circuit Boards","authors":"Wang Zhao-yun, J. Lei, Yang Jia-qiang, Lian Wei-qing, Zhang Dong-ping, Yan G Fang-zu, Sun Shi-gang","doi":"10.13208/J.ELECTROCHEM.201119","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":15595,"journal":{"name":"Journal of Electrochemistry","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electrochemistry","FirstCategoryId":"1089","ListUrlMain":"https://doi.org/10.13208/J.ELECTROCHEM.201119","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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