Viscous behavior of interfaces in fluorine-doped si3n4/sic composites

Abstract

The influence of fluorine addition on the grain/phase boundary structures and their viscous behavior at high temperature were systematically investigated in Si₃N₄/SiC composites. As a reference, a simple system densified by hot isostatic pressing (HIP) and containing only SiO₂at the boundaries was selected for this basic investigation. In addition, increasing amounts of F dopant were incorporated into the composite bodies by adding Teflon during the mixing procedure of the raw powders and then pre-firing the mixture under high vacuum at 1200°C. Analytical transmission electron microscopy showed that fluorine remained localized at the grain boundary films and triple points, constituting an amount up to a few percent by weight of the intergranular glassy-SiO₂phase. Detailed structural characterizations of both grain and phase boundaries were performed by using high-resolution electron microscopy (HREM) and atomic force microscopy (AFM). The high-temperature mechanical behavior of the undoped and F-doped SiO₂phases was characterized by both measurements of torsional creep rate and variation of internal friction at temperatures up to 1600°C. F-doped materials showed creep rates several orders of magnitude higher compared to the undoped sample and damping temperature curves markedly shifted to lower temperature values. According to the above set of microstructural and mechanical data, the inherent viscosity of the SiO₂intergranular phase could be quantitatively evaluated and the viscous-sliding mechanism under stress modeled.